JPS56112771A - Electronic component for light communication - Google Patents

Electronic component for light communication

Info

Publication number
JPS56112771A
JPS56112771A JP1554080A JP1554080A JPS56112771A JP S56112771 A JPS56112771 A JP S56112771A JP 1554080 A JP1554080 A JP 1554080A JP 1554080 A JP1554080 A JP 1554080A JP S56112771 A JPS56112771 A JP S56112771A
Authority
JP
Japan
Prior art keywords
connector
optical fiber
stem
diode
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1554080A
Other languages
Japanese (ja)
Other versions
JPS6327873B2 (en
Inventor
Masahiro Ichiki
Yoichi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1554080A priority Critical patent/JPS56112771A/en
Publication of JPS56112771A publication Critical patent/JPS56112771A/en
Publication of JPS6327873B2 publication Critical patent/JPS6327873B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Abstract

PURPOSE:To improve the workability of a work for mounting an optical fiber by forming a cylindrical connector in the vicinity of the mounting end of the optical fiber, inserting the connector into the optical fiber inserting hole of the electronic component for the light communication and connecting thereat. CONSTITUTION:An infrared ray emitting diode 4 is fixed on a silicon substrate 3 on a stem 2, and connected to an external circuit via a lead wire 6 passing through the stem 2, a wire 9 and a wire on the substrate 3. On the other hand, a cap 5 for surrounding the diode 4 is fixed to the stem 2. The connector 15 formed of low melting point glass is mounted beforehand in the vicinity of the end of the optical fiber 10 formed with a spherical unit 13 at the end. The fiber 10 is inserted through a guide tube 11 of the cap 5, and when the spherical unit 13 reaches a predetermined position with respect to the diode 4, the connector 5 is heated to fusion-bond the connector 15 to the inner wall of the guide tube 11 fixedly.
JP1554080A 1980-02-13 1980-02-13 Electronic component for light communication Granted JPS56112771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1554080A JPS56112771A (en) 1980-02-13 1980-02-13 Electronic component for light communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1554080A JPS56112771A (en) 1980-02-13 1980-02-13 Electronic component for light communication

Publications (2)

Publication Number Publication Date
JPS56112771A true JPS56112771A (en) 1981-09-05
JPS6327873B2 JPS6327873B2 (en) 1988-06-06

Family

ID=11891621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1554080A Granted JPS56112771A (en) 1980-02-13 1980-02-13 Electronic component for light communication

Country Status (1)

Country Link
JP (1) JPS56112771A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101882A (en) * 1982-12-03 1984-06-12 Nec Corp Photo semiconductor device
WO2007090365A1 (en) * 2006-02-06 2007-08-16 Osram Opto Semiconductors Gmbh Housing for a light-emitting diode component, and a light-emitting diode component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441669U (en) * 1990-03-06 1992-04-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101882A (en) * 1982-12-03 1984-06-12 Nec Corp Photo semiconductor device
WO2007090365A1 (en) * 2006-02-06 2007-08-16 Osram Opto Semiconductors Gmbh Housing for a light-emitting diode component, and a light-emitting diode component

Also Published As

Publication number Publication date
JPS6327873B2 (en) 1988-06-06

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