JPS55146986A - Semiconductor photoelement and its manufacturing - Google Patents
Semiconductor photoelement and its manufacturingInfo
- Publication number
- JPS55146986A JPS55146986A JP5462179A JP5462179A JPS55146986A JP S55146986 A JPS55146986 A JP S55146986A JP 5462179 A JP5462179 A JP 5462179A JP 5462179 A JP5462179 A JP 5462179A JP S55146986 A JPS55146986 A JP S55146986A
- Authority
- JP
- Japan
- Prior art keywords
- package
- guide
- tip end
- optical fiber
- receiving part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
- G02B6/4203—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Abstract
PURPOSE:To make the element suitable to mass production by putting a light emission or reception element in a package, by inserting a light transmission guide, which has a focusing medium in its tip end, into the package on making it opposite to the light emitting or receiving part and by requiring no splice. CONSTITUTION:The semiconductor light emission or reception element 1 is put in the package 5, the light transmission guide 4, the tip end of which is provided with the focusing medium 7 that is to be opposite to the light emitting or receiving part 2, is put through the package 5. In this case, the guide 4 is made of hard glass tube, the spherical glass lens 7 is attached to the tip of the tube with adhesive 8, the optical fiber 3 is inserted into the guide 4 and its tip end is made contact with the lens 7. After this, the free end of the projected optical fiber 3 is secured with the jacket 9 of the fixed bed 10. In this way, the manufacturing means can be standardized and the manufacture can remarkably be eased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54054621A JPS6013318B2 (en) | 1979-05-03 | 1979-05-03 | Manufacturing method of semiconductor optical device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54054621A JPS6013318B2 (en) | 1979-05-03 | 1979-05-03 | Manufacturing method of semiconductor optical device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55146986A true JPS55146986A (en) | 1980-11-15 |
JPS6013318B2 JPS6013318B2 (en) | 1985-04-06 |
Family
ID=12975803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54054621A Expired JPS6013318B2 (en) | 1979-05-03 | 1979-05-03 | Manufacturing method of semiconductor optical device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6013318B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58103187A (en) * | 1981-12-15 | 1983-06-20 | Mitsubishi Electric Corp | Laser diode module |
JPH02217810A (en) * | 1989-02-17 | 1990-08-30 | Fujitsu Ltd | Optical coupling method by microlens |
JPH04243179A (en) * | 1991-01-17 | 1992-08-31 | Nec Corp | Connector attachment/detachment type semiconductor laser module |
-
1979
- 1979-05-03 JP JP54054621A patent/JPS6013318B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58103187A (en) * | 1981-12-15 | 1983-06-20 | Mitsubishi Electric Corp | Laser diode module |
JPH02217810A (en) * | 1989-02-17 | 1990-08-30 | Fujitsu Ltd | Optical coupling method by microlens |
JPH04243179A (en) * | 1991-01-17 | 1992-08-31 | Nec Corp | Connector attachment/detachment type semiconductor laser module |
Also Published As
Publication number | Publication date |
---|---|
JPS6013318B2 (en) | 1985-04-06 |
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