JPS55166943A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55166943A
JPS55166943A JP7528979A JP7528979A JPS55166943A JP S55166943 A JPS55166943 A JP S55166943A JP 7528979 A JP7528979 A JP 7528979A JP 7528979 A JP7528979 A JP 7528979A JP S55166943 A JPS55166943 A JP S55166943A
Authority
JP
Japan
Prior art keywords
radiation
insulating layer
shielding
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7528979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5712292B2 (https=
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7528979A priority Critical patent/JPS55166943A/ja
Priority to PCT/JP1980/000131 priority patent/WO1980002891A1/ja
Priority to DE8080901079T priority patent/DE3071242D1/de
Publication of JPS55166943A publication Critical patent/JPS55166943A/ja
Priority to EP80901079A priority patent/EP0029858B1/en
Publication of JPS5712292B2 publication Critical patent/JPS5712292B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7528979A 1979-06-15 1979-06-15 Semiconductor device Granted JPS55166943A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7528979A JPS55166943A (en) 1979-06-15 1979-06-15 Semiconductor device
PCT/JP1980/000131 WO1980002891A1 (en) 1979-06-15 1980-06-14 Semiconductor device
DE8080901079T DE3071242D1 (en) 1979-06-15 1980-06-14 Semiconductor device
EP80901079A EP0029858B1 (en) 1979-06-15 1980-12-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7528979A JPS55166943A (en) 1979-06-15 1979-06-15 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55166943A true JPS55166943A (en) 1980-12-26
JPS5712292B2 JPS5712292B2 (https=) 1982-03-10

Family

ID=13571920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7528979A Granted JPS55166943A (en) 1979-06-15 1979-06-15 Semiconductor device

Country Status (4)

Country Link
EP (1) EP0029858B1 (https=)
JP (1) JPS55166943A (https=)
DE (1) DE3071242D1 (https=)
WO (1) WO1980002891A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828860A (ja) * 1981-08-12 1983-02-19 Nec Corp 半導体装置及びその製造方法
JP2008051128A (ja) * 2006-08-22 2008-03-06 Mazda Motor Corp 変速機

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423548A (en) * 1981-07-06 1984-01-03 Motorola, Inc. Method for protecting a semiconductor device from radiation indirect failures
US4519050A (en) * 1982-06-17 1985-05-21 Intel Corporation Radiation shield for an integrated circuit memory with redundant elements
FR2584863B1 (fr) * 1985-07-12 1988-10-21 Inf Milit Spatiale Aeronaut Composant electronique durci vis-a-vis des radiations
US5432127A (en) * 1989-06-30 1995-07-11 Texas Instruments Incorporated Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads
DE4115043A1 (de) * 1991-05-08 1997-07-17 Gen Electric Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
GB2279803B (en) * 1990-04-05 1995-05-24 Gen Electric A high density interconnect structure including a chamber
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
DE102015205051A1 (de) * 2015-03-20 2016-09-22 Robert Bosch Gmbh Elektronikmodul mit Alphastrahlenschutz für eine Getriebesteuereinheit sowie Getriebesteuereinheit
WO2017110406A1 (ja) 2015-12-25 2017-06-29 東芝ライフスタイル株式会社 洗濯機
EP3915672A1 (en) 2016-07-25 2021-12-01 Shibata Corporation Bubble generating device
JP6978793B2 (ja) 2019-07-26 2021-12-08 株式会社シバタ ファインバブル発生装置及び水処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
DE2543968A1 (de) * 1975-10-02 1977-04-07 Licentia Gmbh Integrierte schaltungsanordnung
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828860A (ja) * 1981-08-12 1983-02-19 Nec Corp 半導体装置及びその製造方法
JP2008051128A (ja) * 2006-08-22 2008-03-06 Mazda Motor Corp 変速機

Also Published As

Publication number Publication date
EP0029858A4 (en) 1982-12-09
DE3071242D1 (en) 1986-01-02
WO1980002891A1 (en) 1980-12-24
EP0029858B1 (en) 1985-11-21
JPS5712292B2 (https=) 1982-03-10
EP0029858A1 (en) 1981-06-10

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