DE3071242D1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
DE3071242D1
DE3071242D1 DE8080901079T DE3071242T DE3071242D1 DE 3071242 D1 DE3071242 D1 DE 3071242D1 DE 8080901079 T DE8080901079 T DE 8080901079T DE 3071242 T DE3071242 T DE 3071242T DE 3071242 D1 DE3071242 D1 DE 3071242D1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080901079T
Other languages
German (de)
English (en)
Inventor
Norio - Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3071242D1 publication Critical patent/DE3071242D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
DE8080901079T 1979-06-15 1980-06-14 Semiconductor device Expired DE3071242D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7528979A JPS55166943A (en) 1979-06-15 1979-06-15 Semiconductor device
PCT/JP1980/000131 WO1980002891A1 (en) 1979-06-15 1980-06-14 Semiconductor device

Publications (1)

Publication Number Publication Date
DE3071242D1 true DE3071242D1 (en) 1986-01-02

Family

ID=13571920

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080901079T Expired DE3071242D1 (en) 1979-06-15 1980-06-14 Semiconductor device

Country Status (4)

Country Link
EP (1) EP0029858B1 (https=)
JP (1) JPS55166943A (https=)
DE (1) DE3071242D1 (https=)
WO (1) WO1980002891A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423548A (en) * 1981-07-06 1984-01-03 Motorola, Inc. Method for protecting a semiconductor device from radiation indirect failures
JPS5828860A (ja) * 1981-08-12 1983-02-19 Nec Corp 半導体装置及びその製造方法
US4519050A (en) * 1982-06-17 1985-05-21 Intel Corporation Radiation shield for an integrated circuit memory with redundant elements
FR2584863B1 (fr) * 1985-07-12 1988-10-21 Inf Milit Spatiale Aeronaut Composant electronique durci vis-a-vis des radiations
US5432127A (en) * 1989-06-30 1995-07-11 Texas Instruments Incorporated Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads
DE4115043A1 (de) * 1991-05-08 1997-07-17 Gen Electric Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
GB2279803B (en) * 1990-04-05 1995-05-24 Gen Electric A high density interconnect structure including a chamber
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
JP2008051128A (ja) * 2006-08-22 2008-03-06 Mazda Motor Corp 変速機
DE102015205051A1 (de) * 2015-03-20 2016-09-22 Robert Bosch Gmbh Elektronikmodul mit Alphastrahlenschutz für eine Getriebesteuereinheit sowie Getriebesteuereinheit
WO2017110406A1 (ja) 2015-12-25 2017-06-29 東芝ライフスタイル株式会社 洗濯機
EP3915672A1 (en) 2016-07-25 2021-12-01 Shibata Corporation Bubble generating device
JP6978793B2 (ja) 2019-07-26 2021-12-08 株式会社シバタ ファインバブル発生装置及び水処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
DE2543968A1 (de) * 1975-10-02 1977-04-07 Licentia Gmbh Integrierte schaltungsanordnung
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
EP0029858A4 (en) 1982-12-09
JPS55166943A (en) 1980-12-26
WO1980002891A1 (en) 1980-12-24
EP0029858B1 (en) 1985-11-21
JPS5712292B2 (https=) 1982-03-10
EP0029858A1 (en) 1981-06-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee