JPS55165659A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165659A
JPS55165659A JP7318179A JP7318179A JPS55165659A JP S55165659 A JPS55165659 A JP S55165659A JP 7318179 A JP7318179 A JP 7318179A JP 7318179 A JP7318179 A JP 7318179A JP S55165659 A JPS55165659 A JP S55165659A
Authority
JP
Japan
Prior art keywords
opening
carrier
board
radiator
central part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7318179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142865B2 (enrdf_load_html_response
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7318179A priority Critical patent/JPS55165659A/ja
Publication of JPS55165659A publication Critical patent/JPS55165659A/ja
Publication of JPS6142865B2 publication Critical patent/JPS6142865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7318179A 1979-06-11 1979-06-11 Semiconductor device Granted JPS55165659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165659A true JPS55165659A (en) 1980-12-24
JPS6142865B2 JPS6142865B2 (enrdf_load_html_response) 1986-09-24

Family

ID=13510705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318179A Granted JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165659A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated extensive cooling surfaces for power modules.
CN107316852A (zh) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated extensive cooling surfaces for power modules.
CN107316852A (zh) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件
CN107316852B (zh) * 2017-08-08 2019-09-27 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件

Also Published As

Publication number Publication date
JPS6142865B2 (enrdf_load_html_response) 1986-09-24

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