JPS55153389A - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPS55153389A JPS55153389A JP6200679A JP6200679A JPS55153389A JP S55153389 A JPS55153389 A JP S55153389A JP 6200679 A JP6200679 A JP 6200679A JP 6200679 A JP6200679 A JP 6200679A JP S55153389 A JPS55153389 A JP S55153389A
- Authority
- JP
- Japan
- Prior art keywords
- high temperature
- metal layers
- semiconductor laser
- laser
- highly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0236—Fixing laser chips on mounts using an adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
Abstract
PURPOSE:To obtain a highly reliable device capable of withstanding high temperature by the heat welding technique that metals joint together under the mechanical pressure at a high temperature. CONSTITUTION:AlGaAs undergoes the multi-layer epitaxial growth to form a semiconductor laser 1 with a double heterostructure. To dissipate the heat on an active layer 5 as a thermal surface, the laser is bonded on a diamond heat sink 2 with p side downward. The highly adhesive first metal layers 3, 3' and 3'' including Ti, Zr, Hf, Cr, Mo and W is fomed at the thickness of about 0.01-0.1mum and highly conductive and malleable second metal layers 4, 4' and 4'' including Au, Ag, Cu and Al is evaporated under vacuum on the first metal layers at the thickness of about 1-5mum. Then, the pressure is applied on the laser above the specified level to joint the components by the heat welding while it is maintained above the specified temperature. Thus, a highly reliable semiconductor laser device withstanding high temperature can be produced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6200679A JPS55153389A (en) | 1979-05-18 | 1979-05-18 | Semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6200679A JPS55153389A (en) | 1979-05-18 | 1979-05-18 | Semiconductor laser device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55153389A true JPS55153389A (en) | 1980-11-29 |
Family
ID=13187628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6200679A Pending JPS55153389A (en) | 1979-05-18 | 1979-05-18 | Semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55153389A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728628A (en) * | 1984-03-12 | 1988-03-01 | British Telecommunications Public Limited Company | Method of making ridge waveguide lasers |
EP0317124A2 (en) * | 1987-11-16 | 1989-05-24 | Crystallume | Silicon on insulator semiconductor components containing thin synthetic diamond films |
EP0766354A1 (en) * | 1995-09-29 | 1997-04-02 | Siemens Aktiengesellschaft | Laser diode construction element with heat sink |
WO2000063967A1 (en) * | 1999-04-20 | 2000-10-26 | Toyo Kohan Co., Ltd. | Heat sink base, heat sink, and method of manufacturing heat sink |
GB2525290A (en) * | 2014-02-26 | 2015-10-21 | Element Six N V | Mounted diamond components and methods of fabricating the same |
-
1979
- 1979-05-18 JP JP6200679A patent/JPS55153389A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728628A (en) * | 1984-03-12 | 1988-03-01 | British Telecommunications Public Limited Company | Method of making ridge waveguide lasers |
EP0317124A2 (en) * | 1987-11-16 | 1989-05-24 | Crystallume | Silicon on insulator semiconductor components containing thin synthetic diamond films |
EP0766354A1 (en) * | 1995-09-29 | 1997-04-02 | Siemens Aktiengesellschaft | Laser diode construction element with heat sink |
US5812570A (en) * | 1995-09-29 | 1998-09-22 | Siemens Aktiengesellschaft | Laser diode component with heat sink and method of producing a plurality of laser diode components |
WO2000063967A1 (en) * | 1999-04-20 | 2000-10-26 | Toyo Kohan Co., Ltd. | Heat sink base, heat sink, and method of manufacturing heat sink |
GB2525290A (en) * | 2014-02-26 | 2015-10-21 | Element Six N V | Mounted diamond components and methods of fabricating the same |
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