JPS55153361A - Chip type electronic part and its manufacturing method - Google Patents

Chip type electronic part and its manufacturing method

Info

Publication number
JPS55153361A
JPS55153361A JP6183479A JP6183479A JPS55153361A JP S55153361 A JPS55153361 A JP S55153361A JP 6183479 A JP6183479 A JP 6183479A JP 6183479 A JP6183479 A JP 6183479A JP S55153361 A JPS55153361 A JP S55153361A
Authority
JP
Japan
Prior art keywords
plate
hole
type electronic
chip type
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6183479A
Other languages
Japanese (ja)
Other versions
JPS6041847B2 (en
Inventor
Nobumasa Oshima
Tsunehiko Todoroki
Shigeaki Nakada
Masahiro Oida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54061834A priority Critical patent/JPS6041847B2/en
Priority to GB8016039A priority patent/GB2053568B/en
Priority to DE19803018846 priority patent/DE3018846A1/en
Priority to FR8011055A priority patent/FR2457005A1/en
Publication of JPS55153361A publication Critical patent/JPS55153361A/en
Publication of JPS6041847B2 publication Critical patent/JPS6041847B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain a method suited for processing of multiple pieces by providing a hole for storage of a perfected chip type electronic part and a groove for the lead wire leading to the electrode plate on the insulated plate on both sides of which metal foils are pasted making an electrode plate, and by cutting the insulated plate into individual pieces after the storage of parts. CONSTITUTION:A copper foil 8 and a nickel foil 9, to be used as an electrode plate, are pasted on both sides of a phenol resin insulated plate 7 using a bonding agent, the thickness suitable to store the perfected chip type electronic part is given to the insulated plate 7, it is cut horizontally into a rectangular-shaped resin plate 10. Then a hole 11 to store a part 13 and a thin groove 12, to be used for connection of the lead wire 14 of the part 13 to the metal foils 8 and 9 respectively, are provided with an equal interval, and after inserting the part 13 in the hole 11, the lead wire 14 protruding from the part 13 is connected to the metal foils 8 and 9 using the groove 12. Subsequently, a colored epoxy resin 15 is filled in the vacent space in the hole 11 in order to have an easy identification and the resin plate 10 is cut with a piece of the part 13 contained.
JP54061834A 1979-05-18 1979-05-18 Manufacturing method for chip-type electronic components Expired JPS6041847B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP54061834A JPS6041847B2 (en) 1979-05-18 1979-05-18 Manufacturing method for chip-type electronic components
GB8016039A GB2053568B (en) 1979-05-18 1980-05-15 Chip type electronic component
DE19803018846 DE3018846A1 (en) 1979-05-18 1980-05-16 ELECTRONIC COMPONENT IN CHIP FORM AND METHOD FOR PRODUCING THE SAME
FR8011055A FR2457005A1 (en) 1979-05-18 1980-05-16 ELECTRONIC COMPONENT OF THE CHIP TYPE AND MANUFACTURING METHOD THEREOF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54061834A JPS6041847B2 (en) 1979-05-18 1979-05-18 Manufacturing method for chip-type electronic components

Publications (2)

Publication Number Publication Date
JPS55153361A true JPS55153361A (en) 1980-11-29
JPS6041847B2 JPS6041847B2 (en) 1985-09-19

Family

ID=13182514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54061834A Expired JPS6041847B2 (en) 1979-05-18 1979-05-18 Manufacturing method for chip-type electronic components

Country Status (4)

Country Link
JP (1) JPS6041847B2 (en)
DE (1) DE3018846A1 (en)
FR (1) FR2457005A1 (en)
GB (1) GB2053568B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488204A (en) * 1983-11-01 1984-12-11 Union Carbide Corporation Device for use in making encapsulated chip capacitor assemblies

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
DE3134617C2 (en) * 1981-09-01 1989-11-02 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Foil capacitor
DE3619311A1 (en) * 1986-06-07 1987-12-10 Telefunken Electronic Gmbh Solar generator of high area efficiency
DE3638342A1 (en) * 1986-11-10 1988-05-19 Siemens Ag Electrical component, made of ceramic and having multilayer metallisation, and a method for its production
ATE69908T1 (en) * 1987-05-05 1991-12-15 Siemens Ag ELECTRICAL COMPONENT IN CHIP CONSTRUCTION AND PROCESS FOR ITS MANUFACTURE.
DE59008794D1 (en) * 1989-09-19 1995-05-04 Siemens Ag Method for producing a solid electrolytic capacitor in chip design with a fuse element.
US5491111A (en) * 1994-10-26 1996-02-13 Tai; George Method of making a semiconductor diode
JP3520776B2 (en) * 1998-05-28 2004-04-19 株式会社村田製作所 Electronic components
DE10131236B4 (en) * 2001-06-28 2006-03-30 Epcos Ag capacitor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3221089A (en) * 1960-07-01 1965-11-30 James H Cotton Method for capacitor fabrication
US3345544A (en) * 1965-05-17 1967-10-03 Mallory & Co Inc P R Solid aluminum capacitors having a proted dielectric oxide film
FR1566728A (en) * 1968-03-29 1969-05-09
FR2054755A5 (en) * 1969-07-25 1971-05-07 Asscher Jean
FR2079769A6 (en) * 1970-02-02 1971-11-12 Asscher Jean Claude
US4247883A (en) * 1978-07-31 1981-01-27 Sprague Electric Company Encapsulated capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488204A (en) * 1983-11-01 1984-12-11 Union Carbide Corporation Device for use in making encapsulated chip capacitor assemblies

Also Published As

Publication number Publication date
JPS6041847B2 (en) 1985-09-19
FR2457005A1 (en) 1980-12-12
FR2457005B1 (en) 1984-04-06
GB2053568B (en) 1983-12-14
DE3018846C2 (en) 1989-07-27
GB2053568A (en) 1981-02-04
DE3018846A1 (en) 1980-12-18

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