FR2457005A1 - ELECTRONIC COMPONENT OF THE CHIP TYPE AND MANUFACTURING METHOD THEREOF - Google Patents

ELECTRONIC COMPONENT OF THE CHIP TYPE AND MANUFACTURING METHOD THEREOF

Info

Publication number
FR2457005A1
FR2457005A1 FR8011055A FR8011055A FR2457005A1 FR 2457005 A1 FR2457005 A1 FR 2457005A1 FR 8011055 A FR8011055 A FR 8011055A FR 8011055 A FR8011055 A FR 8011055A FR 2457005 A1 FR2457005 A1 FR 2457005A1
Authority
FR
France
Prior art keywords
chassis
electronic component
metal
chip type
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8011055A
Other languages
French (fr)
Other versions
FR2457005B1 (en
Inventor
Koreaki Nakata
Tsunehiko Todoroki
Masahiro Oita
Nobumasa Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of FR2457005A1 publication Critical patent/FR2457005A1/en
Application granted granted Critical
Publication of FR2457005B1 publication Critical patent/FR2457005B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

L'INVENTION CONCERNE UN COMPOSANT ELECTRONIQUE DU TYPE PUCE, PLUS PARTICULIEREMENT UN CONDENSATEUR AU TANTALE DU TYPE PUCE, DONT LES ELECTRODES DE BORNE EN CLINQUANT METALLIQUE SONT LIEES RIGIDEMENT A UN ENSEMBLE EN RESINE. LE COMPOSANT ELECTRONIQUE SELON L'INVENTION COMPREND: UN CHASSIS EN RESINE ISOLANTE 21, UNE PAIRE DE BORNES SENSIBLEMENT PLATES EN CLINQUANT METALLIQUE 31, 32 LIEES AUX DEUX EXTREMITES DU CHASSIS, AU MOINS L'UNE DES EXTREMITES DU CHASSIS COMPORTANT UNE FENTE A TRAVERS LE CHASSIS QUI DEBOUCHE A L'EXTERIEUR DU CLINQUANT METALLIQUE, UN ELEMENT DE COMPOSANT ELECTRONIQUE 1 COMPORTANT UNE PAIRE DE BORNES 5A, 5B ENFERME DANS LE CHASSIS, LES BORNES ETANT CONNECTEES ELECTRIQUEMENT AU CLINQUANT METALLIQUE CORRESPONDANT ET UNE RESINE ISOLANTE 22 QUI REMPLIT L'ESPACE RESTANT A L'INTERIEUR DU CHASSIS.THE INVENTION RELATES TO AN ELECTRONIC COMPONENT OF THE CHIP TYPE, MORE PARTICULARLY A TANTALUM CAPACITOR OF THE CHIP TYPE, THE METAL CLINKING TERMINAL ELECTRODES OF WHICH ARE STRONGLY BOUND TO A RESIN ASSEMBLY. THE ELECTRONIC COMPONENT ACCORDING TO THE INVENTION INCLUDES: A CHASSIS IN INSULATING RESIN 21, A PAIR OF SENSITIVELY FLAT TERMINALS WITH METAL CLINCHING 31, 32 LINKED TO BOTH ENDS OF THE CHASSIS, AT LEAST ONE OF THE ENDS OF THE CHASSIS WITH A SLOT THROUGH THE CHASSIS. CHASSIS WHICH OPENS OUTSIDE THE METAL CLINQUANT, AN ELECTRONIC COMPONENT ELEMENT 1 INCLUDING A PAIR OF TERMINALS 5A, 5B ENCLOSED IN THE CHASSIS, THE TERMINALS BEING ELECTRICALLY CONNECTED TO THE CORRESPONDING METAL CLINQUANT AND A REPLACING METAL QUPACE 22 INSIDE THE CHASSIS.

FR8011055A 1979-05-18 1980-05-16 ELECTRONIC COMPONENT OF THE CHIP TYPE AND MANUFACTURING METHOD THEREOF Granted FR2457005A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54061834A JPS6041847B2 (en) 1979-05-18 1979-05-18 Manufacturing method for chip-type electronic components

Publications (2)

Publication Number Publication Date
FR2457005A1 true FR2457005A1 (en) 1980-12-12
FR2457005B1 FR2457005B1 (en) 1984-04-06

Family

ID=13182514

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8011055A Granted FR2457005A1 (en) 1979-05-18 1980-05-16 ELECTRONIC COMPONENT OF THE CHIP TYPE AND MANUFACTURING METHOD THEREOF

Country Status (4)

Country Link
JP (1) JPS6041847B2 (en)
DE (1) DE3018846A1 (en)
FR (1) FR2457005A1 (en)
GB (1) GB2053568B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289934A1 (en) * 1987-05-05 1988-11-09 Siemens Aktiengesellschaft Chip-type electric component and method for its production

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
DE3134617C2 (en) * 1981-09-01 1989-11-02 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Foil capacitor
US4488204A (en) * 1983-11-01 1984-12-11 Union Carbide Corporation Device for use in making encapsulated chip capacitor assemblies
DE3619311A1 (en) * 1986-06-07 1987-12-10 Telefunken Electronic Gmbh Solar generator of high area efficiency
DE3638342A1 (en) * 1986-11-10 1988-05-19 Siemens Ag Electrical component, made of ceramic and having multilayer metallisation, and a method for its production
DE59008794D1 (en) * 1989-09-19 1995-05-04 Siemens Ag Method for producing a solid electrolytic capacitor in chip design with a fuse element.
US5491111A (en) * 1994-10-26 1996-02-13 Tai; George Method of making a semiconductor diode
JP3520776B2 (en) * 1998-05-28 2004-04-19 株式会社村田製作所 Electronic components
DE10131236B4 (en) * 2001-06-28 2006-03-30 Epcos Ag capacitor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1566728A (en) * 1968-03-29 1969-05-09
FR2054755A5 (en) * 1969-07-25 1971-05-07 Asscher Jean
FR2079769A6 (en) * 1970-02-02 1971-11-12 Asscher Jean Claude

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3221089A (en) * 1960-07-01 1965-11-30 James H Cotton Method for capacitor fabrication
US3345544A (en) * 1965-05-17 1967-10-03 Mallory & Co Inc P R Solid aluminum capacitors having a proted dielectric oxide film
US4247883A (en) * 1978-07-31 1981-01-27 Sprague Electric Company Encapsulated capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1566728A (en) * 1968-03-29 1969-05-09
FR2054755A5 (en) * 1969-07-25 1971-05-07 Asscher Jean
FR2079769A6 (en) * 1970-02-02 1971-11-12 Asscher Jean Claude

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289934A1 (en) * 1987-05-05 1988-11-09 Siemens Aktiengesellschaft Chip-type electric component and method for its production

Also Published As

Publication number Publication date
JPS55153361A (en) 1980-11-29
JPS6041847B2 (en) 1985-09-19
FR2457005B1 (en) 1984-04-06
GB2053568B (en) 1983-12-14
DE3018846C2 (en) 1989-07-27
GB2053568A (en) 1981-02-04
DE3018846A1 (en) 1980-12-18

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Legal Events

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