JPS5515254A - Manufacturing method for semiconductor device - Google Patents
Manufacturing method for semiconductor deviceInfo
- Publication number
- JPS5515254A JPS5515254A JP8859378A JP8859378A JPS5515254A JP S5515254 A JPS5515254 A JP S5515254A JP 8859378 A JP8859378 A JP 8859378A JP 8859378 A JP8859378 A JP 8859378A JP S5515254 A JPS5515254 A JP S5515254A
- Authority
- JP
- Japan
- Prior art keywords
- light
- interference
- film
- thickness
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To effect a pattern alignment of a mask even if the step difference of a film thickness may be slight by making use of the interference of a light in the thin film.
CONSTITUTION: When a light of wavelength of λ is projected to a thin film having a thickness d and a defractive rate n, the interference of the light is canceled if 2d=(2k-1/2).λ/n. cap. When the light with the wavelenght λ1 is projected to a portion A with the thickness d1 of an oxidization film 2, the portion A is turned to black color, but any interference is not caused in a portion B and the light with the wavelength λ1 is appeared only. Therefore, a pattern alignment for a mask 4 can be performed. The light having an appropriate wavelength can be obtained by inserting a colored glass before a white light source. According to this construction, the desirable pattern alignment capable of discrimination cna be established by making use of the interference due to a signal color light even if the discrimination of the film surface can not fully made due to the surface step.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8859378A JPS5515254A (en) | 1978-07-19 | 1978-07-19 | Manufacturing method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8859378A JPS5515254A (en) | 1978-07-19 | 1978-07-19 | Manufacturing method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5515254A true JPS5515254A (en) | 1980-02-02 |
Family
ID=13947120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8859378A Pending JPS5515254A (en) | 1978-07-19 | 1978-07-19 | Manufacturing method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5515254A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63142609A (en) * | 1986-12-05 | 1988-06-15 | Taamo:Kk | Engaging tool |
-
1978
- 1978-07-19 JP JP8859378A patent/JPS5515254A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63142609A (en) * | 1986-12-05 | 1988-06-15 | Taamo:Kk | Engaging tool |
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