JPS55150233A - Apparatus for treating semiconductor wafer - Google Patents
Apparatus for treating semiconductor waferInfo
- Publication number
- JPS55150233A JPS55150233A JP4463480A JP4463480A JPS55150233A JP S55150233 A JPS55150233 A JP S55150233A JP 4463480 A JP4463480 A JP 4463480A JP 4463480 A JP4463480 A JP 4463480A JP S55150233 A JPS55150233 A JP S55150233A
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- flowing paths
- solution
- box
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 8
- 235000012431 wafers Nutrition 0.000 abstract 5
- 239000007788 liquid Substances 0.000 abstract 2
- 230000000007 visual effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4463480A JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4463480A JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3962572A Division JPS5546054B2 (US07202987-20070410-C00007.png) | 1972-04-21 | 1972-04-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55150233A true JPS55150233A (en) | 1980-11-22 |
JPS5734651B2 JPS5734651B2 (US07202987-20070410-C00007.png) | 1982-07-24 |
Family
ID=12696852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4463480A Granted JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55150233A (US07202987-20070410-C00007.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007058876A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6268349U (US07202987-20070410-C00007.png) * | 1985-10-17 | 1987-04-28 |
-
1980
- 1980-04-07 JP JP4463480A patent/JPS55150233A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007058876A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen |
Also Published As
Publication number | Publication date |
---|---|
JPS5734651B2 (US07202987-20070410-C00007.png) | 1982-07-24 |
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