JPS55141741A - Fabricating method of circuit board for electronic watch - Google Patents

Fabricating method of circuit board for electronic watch

Info

Publication number
JPS55141741A
JPS55141741A JP4806779A JP4806779A JPS55141741A JP S55141741 A JPS55141741 A JP S55141741A JP 4806779 A JP4806779 A JP 4806779A JP 4806779 A JP4806779 A JP 4806779A JP S55141741 A JPS55141741 A JP S55141741A
Authority
JP
Japan
Prior art keywords
fpc
molding
mold
upper die
printed coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4806779A
Other languages
Japanese (ja)
Inventor
Kenichi Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP4806779A priority Critical patent/JPS55141741A/en
Publication of JPS55141741A publication Critical patent/JPS55141741A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To retain the flatness of a flexible printed coating (FPC) at an insert molding time and to obtain a plastic substrate having high reliability by inserting the flexible printed coating and forming the plastic substrates twice at the boundary of the FPC. CONSTITUTION:A flexible printed coating printed coating (FPC) 2 is inserted into a lower die 15 of a mold for the first molding. Since a upper die 14 is flat except a portion becoming the sealing portion of an IC chip 9, the upper die 14 makes, when the mold is closed, contact with the entire surface of the FPC 2, and FPC 2 is urged into the upper die 14 by the plastic flown from the lower die 15 at molding time. At this time the FPC 2 retains flat without deformation. The plastic substrate 1 is molded, as shown, at the half portion thereof in the first molding. Then, the lower die 15 is moved to mold the residual portion, and aligned with one more upper die (not shown) to mold the residual portion. At this time the second molding is executed, and the plastic substrate 1 is completed.
JP4806779A 1979-04-20 1979-04-20 Fabricating method of circuit board for electronic watch Pending JPS55141741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4806779A JPS55141741A (en) 1979-04-20 1979-04-20 Fabricating method of circuit board for electronic watch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4806779A JPS55141741A (en) 1979-04-20 1979-04-20 Fabricating method of circuit board for electronic watch

Publications (1)

Publication Number Publication Date
JPS55141741A true JPS55141741A (en) 1980-11-05

Family

ID=12792998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4806779A Pending JPS55141741A (en) 1979-04-20 1979-04-20 Fabricating method of circuit board for electronic watch

Country Status (1)

Country Link
JP (1) JPS55141741A (en)

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