JPS55141742A - Circuit board for watch - Google Patents
Circuit board for watchInfo
- Publication number
- JPS55141742A JPS55141742A JP4806579A JP4806579A JPS55141742A JP S55141742 A JPS55141742 A JP S55141742A JP 4806579 A JP4806579 A JP 4806579A JP 4806579 A JP4806579 A JP 4806579A JP S55141742 A JPS55141742 A JP S55141742A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- watch
- fpc
- molded
- external profile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 238000000465 moulding Methods 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract 2
- 230000000717 retained effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To provide an inexpensive and reliable circuit board for a watch by coating the most external profile of the circuit board insert molded by flexible printed coating (FPC) bonded with an IC with molding resin. CONSTITUTION:Flexible printed coating (FPC) 2 is insert molded by thermoplastic resin to enclose an IC 10. Containers 3, 8 and 14 for accommodating other elements forming an electronic watch are simultaneously molded to produce a circuit board 1 for the watch. In order to strengthen the adherence between the FPC 2 and the thermoplastic resin, an opening is perforated at the external profile of the FPC 2 partially with connecting portion 2c retained as designated by two-dotted broken lines. The external profile is so molded as to be coated with the resin when insert molding the circuit board.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4806579A JPS55141742A (en) | 1979-04-20 | 1979-04-20 | Circuit board for watch |
CH40980A CH641626B (en) | 1979-01-18 | 1980-01-18 | METHOD OF MANUFACTURING ELECTRONIC CLOCK MODULES. |
GB8001694A GB2042774B (en) | 1979-01-18 | 1980-01-18 | Fabricating method of electronic watch module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4806579A JPS55141742A (en) | 1979-04-20 | 1979-04-20 | Circuit board for watch |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55141742A true JPS55141742A (en) | 1980-11-05 |
Family
ID=12792941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4806579A Pending JPS55141742A (en) | 1979-01-18 | 1979-04-20 | Circuit board for watch |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55141742A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4910743U (en) * | 1972-04-28 | 1974-01-29 | ||
JPS5341246B2 (en) * | 1974-04-19 | 1978-11-01 |
-
1979
- 1979-04-20 JP JP4806579A patent/JPS55141742A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4910743U (en) * | 1972-04-28 | 1974-01-29 | ||
JPS5341246B2 (en) * | 1974-04-19 | 1978-11-01 |
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