JPS644098A - Thin electronic equipment - Google Patents

Thin electronic equipment

Info

Publication number
JPS644098A
JPS644098A JP15904787A JP15904787A JPS644098A JP S644098 A JPS644098 A JP S644098A JP 15904787 A JP15904787 A JP 15904787A JP 15904787 A JP15904787 A JP 15904787A JP S644098 A JPS644098 A JP S644098A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
electronic components
fixing frame
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15904787A
Other languages
Japanese (ja)
Inventor
Kiyotaka Kumochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP15904787A priority Critical patent/JPS644098A/en
Publication of JPS644098A publication Critical patent/JPS644098A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE:To improve the strength and facilitate the mounting of electronic components by superposing a surface sheet on the surface of a printed circuit board on which a plurality of electronic components are mounted, superposing a rear sheet on the rear of the printed circuit board, and sealing the electronic components mounted on the printed circuit board in the buried section of the fixing frame. CONSTITUTION:A fixing frame 10 has a sealing frame 6 and a frame body 9 which are integrally molded with a liquid crystal polymer or a carbon fiber reinforced plastic as a reinforced plastic. The fixing frame 10 is provided with a throughhole 11 as the buried section into which the electronic components 2 mounted on a printed circuit board 1 are inserted. Also the printed circuit board 1 is bonded to the upper surface of the fixing frame 10 by a thermosetting bonding agent 12. Moreover, in order to protect the electronic components 2 mounted on the printed circuit board 1, the thermosetting resin is sealed in the space between the electronic components 2 and a rear sheet 5. Since the electronic components 2 mounted on the printed circuit board 1 are sealed within the throughhole 11 of the fixing frame 10, the number of components is reduced and the handling becomes easy when mounting components on the printed circuit board 1, thereby improving the transfer speed.
JP15904787A 1987-06-26 1987-06-26 Thin electronic equipment Pending JPS644098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15904787A JPS644098A (en) 1987-06-26 1987-06-26 Thin electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15904787A JPS644098A (en) 1987-06-26 1987-06-26 Thin electronic equipment

Publications (1)

Publication Number Publication Date
JPS644098A true JPS644098A (en) 1989-01-09

Family

ID=15685068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15904787A Pending JPS644098A (en) 1987-06-26 1987-06-26 Thin electronic equipment

Country Status (1)

Country Link
JP (1) JPS644098A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054813A (en) * 1995-04-19 2000-04-25 Harison Electric Co., Ltd. Neon discharging lamp lighting apparatus with improved lighting
US6072637A (en) * 1996-03-06 2000-06-06 Minolta Co., Ltd. Zoom lens system
US6480395B1 (en) 2000-05-25 2002-11-12 Hewlett-Packard Company Device and method for interstitial components in a printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054813A (en) * 1995-04-19 2000-04-25 Harison Electric Co., Ltd. Neon discharging lamp lighting apparatus with improved lighting
US6072637A (en) * 1996-03-06 2000-06-06 Minolta Co., Ltd. Zoom lens system
US6480395B1 (en) 2000-05-25 2002-11-12 Hewlett-Packard Company Device and method for interstitial components in a printed circuit board
US6704207B2 (en) 2000-05-25 2004-03-09 Hewlett-Packard Development Company, L.P. Device and method for interstitial components in a printed circuit board

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