JPS55138848A - Resin sealing mold and method of sealing semiconductor device with resin using the same - Google Patents

Resin sealing mold and method of sealing semiconductor device with resin using the same

Info

Publication number
JPS55138848A
JPS55138848A JP4702779A JP4702779A JPS55138848A JP S55138848 A JPS55138848 A JP S55138848A JP 4702779 A JP4702779 A JP 4702779A JP 4702779 A JP4702779 A JP 4702779A JP S55138848 A JPS55138848 A JP S55138848A
Authority
JP
Japan
Prior art keywords
resin
resin powder
mold means
semiconductor device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4702779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6119105B2 (enExample
Inventor
Hiroyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP4702779A priority Critical patent/JPS55138848A/ja
Publication of JPS55138848A publication Critical patent/JPS55138848A/ja
Publication of JPS6119105B2 publication Critical patent/JPS6119105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B29C45/1808—Feeding measured doses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP4702779A 1979-04-16 1979-04-16 Resin sealing mold and method of sealing semiconductor device with resin using the same Granted JPS55138848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4702779A JPS55138848A (en) 1979-04-16 1979-04-16 Resin sealing mold and method of sealing semiconductor device with resin using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4702779A JPS55138848A (en) 1979-04-16 1979-04-16 Resin sealing mold and method of sealing semiconductor device with resin using the same

Publications (2)

Publication Number Publication Date
JPS55138848A true JPS55138848A (en) 1980-10-30
JPS6119105B2 JPS6119105B2 (enExample) 1986-05-15

Family

ID=12763685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4702779A Granted JPS55138848A (en) 1979-04-16 1979-04-16 Resin sealing mold and method of sealing semiconductor device with resin using the same

Country Status (1)

Country Link
JP (1) JPS55138848A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61167702A (ja) * 1985-01-18 1986-07-29 Sekitan Rotenbori Kikai Gijutsu Kenkyu Kumiai デイジタル制御弁
JPS6235115A (ja) * 1985-08-06 1987-02-16 Matsushita Electric Ind Co Ltd 回転付勢装置

Also Published As

Publication number Publication date
JPS6119105B2 (enExample) 1986-05-15

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