JPS5715427A - Method of plastic sealing for semiconductor device - Google Patents

Method of plastic sealing for semiconductor device

Info

Publication number
JPS5715427A
JPS5715427A JP9011680A JP9011680A JPS5715427A JP S5715427 A JPS5715427 A JP S5715427A JP 9011680 A JP9011680 A JP 9011680A JP 9011680 A JP9011680 A JP 9011680A JP S5715427 A JPS5715427 A JP S5715427A
Authority
JP
Japan
Prior art keywords
resin
cylinder
runner
sealing
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9011680A
Other languages
Japanese (ja)
Inventor
Isamu Yamamoto
Morihisa Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9011680A priority Critical patent/JPS5715427A/en
Publication of JPS5715427A publication Critical patent/JPS5715427A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To decrease the cost of material, in sealing the titled device by which resin is compressed and formed in cavities through a runner, by inserting a resin cylinder for filling the runner on a cylinder by sealing raw material which is inserted in the resin chamber. CONSTITUTION:The sealing cylinder 18 comprising, e.g., a highly pure epoxy material is inserted into a plastic chamber 13 from a guide 14. The length of said cylinder is about 60% that in the conventional method. Then, a cylinder 17 of, e.g., inexpensive phenol resin is inserted on said cylinder 18, and the total amount of the resin becomes a required length. A lead frame, on which chips are placed is held between an upper metal mold 9 and a lower metal mold 10. The metal molds are heated, the resin cylinders 18 and 17 are melted and pushed out by a plunger 15. Then the epoxy resin is filled in a cavities 11-1 and 11-2, and the phenol resin is filled in the runner 13. Since the amount of highly pure epoxy resin is saved, the cost can be decreased.
JP9011680A 1980-06-30 1980-06-30 Method of plastic sealing for semiconductor device Pending JPS5715427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9011680A JPS5715427A (en) 1980-06-30 1980-06-30 Method of plastic sealing for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9011680A JPS5715427A (en) 1980-06-30 1980-06-30 Method of plastic sealing for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5715427A true JPS5715427A (en) 1982-01-26

Family

ID=13989538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9011680A Pending JPS5715427A (en) 1980-06-30 1980-06-30 Method of plastic sealing for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5715427A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63222436A (en) * 1987-03-12 1988-09-16 Toshiba Corp Manufacture of resin sealed semiconductor device
US5431854A (en) * 1992-01-23 1995-07-11 "3P" Licensing B.V. Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63222436A (en) * 1987-03-12 1988-09-16 Toshiba Corp Manufacture of resin sealed semiconductor device
US5431854A (en) * 1992-01-23 1995-07-11 "3P" Licensing B.V. Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material

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