JPS55128578A - Method and apparatus for vacuum deposition plating of metal - Google Patents
Method and apparatus for vacuum deposition plating of metalInfo
- Publication number
- JPS55128578A JPS55128578A JP3597079A JP3597079A JPS55128578A JP S55128578 A JPS55128578 A JP S55128578A JP 3597079 A JP3597079 A JP 3597079A JP 3597079 A JP3597079 A JP 3597079A JP S55128578 A JPS55128578 A JP S55128578A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- furnace
- gas
- pipe
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title abstract 14
- 238000007747 plating Methods 0.000 title abstract 4
- 238000001771 vacuum deposition Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000007789 gas Substances 0.000 abstract 4
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000009849 vacuum degassing Methods 0.000 abstract 1
- 239000002912 waste gas Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3597079A JPS55128578A (en) | 1979-03-27 | 1979-03-27 | Method and apparatus for vacuum deposition plating of metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3597079A JPS55128578A (en) | 1979-03-27 | 1979-03-27 | Method and apparatus for vacuum deposition plating of metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55128578A true JPS55128578A (en) | 1980-10-04 |
JPS6139393B2 JPS6139393B2 (enrdf_load_stackoverflow) | 1986-09-03 |
Family
ID=12456775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3597079A Granted JPS55128578A (en) | 1979-03-27 | 1979-03-27 | Method and apparatus for vacuum deposition plating of metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55128578A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0622628A (ja) * | 1993-06-29 | 1994-02-01 | Iseki & Co Ltd | コンバインの操作装置 |
JP2008500454A (ja) * | 2004-05-27 | 2008-01-10 | ズィードラーベ インコーポレイテッド | 金属及び合金の蒸発による真空蒸着方法及び真空蒸着装置 |
JP2010522272A (ja) * | 2007-03-20 | 2010-07-01 | アルセロールミタル・フランス | 基材をコーティングするためのプロセスおよび金属合金真空蒸着装置 |
CN112323022A (zh) * | 2021-01-04 | 2021-02-05 | 度亘激光技术(苏州)有限公司 | 半导体器件的蒸镀方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4871321A (enrdf_load_stackoverflow) * | 1971-12-28 | 1973-09-27 |
-
1979
- 1979-03-27 JP JP3597079A patent/JPS55128578A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4871321A (enrdf_load_stackoverflow) * | 1971-12-28 | 1973-09-27 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0622628A (ja) * | 1993-06-29 | 1994-02-01 | Iseki & Co Ltd | コンバインの操作装置 |
JP2008500454A (ja) * | 2004-05-27 | 2008-01-10 | ズィードラーベ インコーポレイテッド | 金属及び合金の蒸発による真空蒸着方法及び真空蒸着装置 |
JP2010522272A (ja) * | 2007-03-20 | 2010-07-01 | アルセロールミタル・フランス | 基材をコーティングするためのプロセスおよび金属合金真空蒸着装置 |
CN112323022A (zh) * | 2021-01-04 | 2021-02-05 | 度亘激光技术(苏州)有限公司 | 半导体器件的蒸镀方法 |
CN112323022B (zh) * | 2021-01-04 | 2021-03-19 | 度亘激光技术(苏州)有限公司 | 半导体器件的蒸镀方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6139393B2 (enrdf_load_stackoverflow) | 1986-09-03 |
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