JPS5512764A - Semiconductor device manufacturing method - Google Patents

Semiconductor device manufacturing method

Info

Publication number
JPS5512764A
JPS5512764A JP8578578A JP8578578A JPS5512764A JP S5512764 A JPS5512764 A JP S5512764A JP 8578578 A JP8578578 A JP 8578578A JP 8578578 A JP8578578 A JP 8578578A JP S5512764 A JPS5512764 A JP S5512764A
Authority
JP
Japan
Prior art keywords
lead
die pad
prescribed
suspended
pad section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8578578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210019B2 (OSRAM
Inventor
Hideji Aoki
Yutaka Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8578578A priority Critical patent/JPS5512764A/ja
Publication of JPS5512764A publication Critical patent/JPS5512764A/ja
Publication of JPS6210019B2 publication Critical patent/JPS6210019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8578578A 1978-07-13 1978-07-13 Semiconductor device manufacturing method Granted JPS5512764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8578578A JPS5512764A (en) 1978-07-13 1978-07-13 Semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8578578A JPS5512764A (en) 1978-07-13 1978-07-13 Semiconductor device manufacturing method

Publications (2)

Publication Number Publication Date
JPS5512764A true JPS5512764A (en) 1980-01-29
JPS6210019B2 JPS6210019B2 (OSRAM) 1987-03-04

Family

ID=13868531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8578578A Granted JPS5512764A (en) 1978-07-13 1978-07-13 Semiconductor device manufacturing method

Country Status (1)

Country Link
JP (1) JPS5512764A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189957A (ja) * 1984-03-12 1985-09-27 Toshiba Corp 半導体装置の製造方法
JPS62193162A (ja) * 1986-02-19 1987-08-25 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
US5291059A (en) * 1991-11-18 1994-03-01 Mitsubishi Denki Kabushiki Kaisha Resin-molded semiconductor device and lead frame employed for fabricating the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189957A (ja) * 1984-03-12 1985-09-27 Toshiba Corp 半導体装置の製造方法
JPS62193162A (ja) * 1986-02-19 1987-08-25 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
US5291059A (en) * 1991-11-18 1994-03-01 Mitsubishi Denki Kabushiki Kaisha Resin-molded semiconductor device and lead frame employed for fabricating the same

Also Published As

Publication number Publication date
JPS6210019B2 (OSRAM) 1987-03-04

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