JPS55127031A - Wire bonding - Google Patents

Wire bonding

Info

Publication number
JPS55127031A
JPS55127031A JP3443679A JP3443679A JPS55127031A JP S55127031 A JPS55127031 A JP S55127031A JP 3443679 A JP3443679 A JP 3443679A JP 3443679 A JP3443679 A JP 3443679A JP S55127031 A JPS55127031 A JP S55127031A
Authority
JP
Japan
Prior art keywords
wire
capillary
lead
bonding pad
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3443679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6329409B2 (enExample
Inventor
Michio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3443679A priority Critical patent/JPS55127031A/ja
Publication of JPS55127031A publication Critical patent/JPS55127031A/ja
Publication of JPS6329409B2 publication Critical patent/JPS6329409B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP3443679A 1979-03-26 1979-03-26 Wire bonding Granted JPS55127031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3443679A JPS55127031A (en) 1979-03-26 1979-03-26 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3443679A JPS55127031A (en) 1979-03-26 1979-03-26 Wire bonding

Publications (2)

Publication Number Publication Date
JPS55127031A true JPS55127031A (en) 1980-10-01
JPS6329409B2 JPS6329409B2 (enExample) 1988-06-14

Family

ID=12414167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3443679A Granted JPS55127031A (en) 1979-03-26 1979-03-26 Wire bonding

Country Status (1)

Country Link
JP (1) JPS55127031A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682808U (ja) * 1993-12-28 1994-11-25 北陸電気工業株式会社 高電圧用可変抵抗器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435679A (en) * 1977-08-25 1979-03-15 Toshiba Corp Semiconductor connection method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435679A (en) * 1977-08-25 1979-03-15 Toshiba Corp Semiconductor connection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682808U (ja) * 1993-12-28 1994-11-25 北陸電気工業株式会社 高電圧用可変抵抗器

Also Published As

Publication number Publication date
JPS6329409B2 (enExample) 1988-06-14

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