JPS55123152A - Heat radiating body - Google Patents

Heat radiating body

Info

Publication number
JPS55123152A
JPS55123152A JP3089879A JP3089879A JPS55123152A JP S55123152 A JPS55123152 A JP S55123152A JP 3089879 A JP3089879 A JP 3089879A JP 3089879 A JP3089879 A JP 3089879A JP S55123152 A JPS55123152 A JP S55123152A
Authority
JP
Japan
Prior art keywords
radiating body
heat radiating
high heat
engraved
main material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3089879A
Other languages
Japanese (ja)
Inventor
Tetsuo Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3089879A priority Critical patent/JPS55123152A/en
Publication of JPS55123152A publication Critical patent/JPS55123152A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a heat radiating body surface with a high heat conductivity by a method wherein an anode oxide film is formed on an Al-main material surface, which is engraved through its pores, concerning the heat radiating body with a surface treated layer of a high heat conductivity used for ebullition cooling. CONSTITUTION:When an Al-main material 1 is immersed in a mixed solution of sulfuric acid, chromic acid, phosphoric acid, etc. or 2 kinds of the acids to form an anode oxide film, Al is dissolved in an electrolyte to form a porous film. When an active layer 4 and a ground metal 1 are engraved through a pore 31 of the porous film after that, a cavity 2 is made to gain a surface condition with a high heat- transfer.
JP3089879A 1979-03-15 1979-03-15 Heat radiating body Pending JPS55123152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3089879A JPS55123152A (en) 1979-03-15 1979-03-15 Heat radiating body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3089879A JPS55123152A (en) 1979-03-15 1979-03-15 Heat radiating body

Publications (1)

Publication Number Publication Date
JPS55123152A true JPS55123152A (en) 1980-09-22

Family

ID=12316542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3089879A Pending JPS55123152A (en) 1979-03-15 1979-03-15 Heat radiating body

Country Status (1)

Country Link
JP (1) JPS55123152A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209630A2 (en) * 1985-07-18 1987-01-28 International Business Machines Corporation Heat transfer element and its use in a circuit package
KR100453693B1 (en) * 1996-12-30 2005-01-31 앰코 테크놀로지 코리아 주식회사 Crack structure of oxide layer of heat spreader for semiconductor package and fabricating method thereof to improve cohesion of package molding of compound material and prevent electrical circuit from being short-circuited
JP2010139187A (en) * 2008-12-12 2010-06-24 Nissan Motor Co Ltd Cooling system
WO2024070224A1 (en) * 2022-09-28 2024-04-04 国立大学法人九州大学 Heat transfer member and production method for same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209630A2 (en) * 1985-07-18 1987-01-28 International Business Machines Corporation Heat transfer element and its use in a circuit package
KR100453693B1 (en) * 1996-12-30 2005-01-31 앰코 테크놀로지 코리아 주식회사 Crack structure of oxide layer of heat spreader for semiconductor package and fabricating method thereof to improve cohesion of package molding of compound material and prevent electrical circuit from being short-circuited
JP2010139187A (en) * 2008-12-12 2010-06-24 Nissan Motor Co Ltd Cooling system
WO2024070224A1 (en) * 2022-09-28 2024-04-04 国立大学法人九州大学 Heat transfer member and production method for same

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