JPS55121663A - Manufacture of package - Google Patents

Manufacture of package

Info

Publication number
JPS55121663A
JPS55121663A JP3036679A JP3036679A JPS55121663A JP S55121663 A JPS55121663 A JP S55121663A JP 3036679 A JP3036679 A JP 3036679A JP 3036679 A JP3036679 A JP 3036679A JP S55121663 A JPS55121663 A JP S55121663A
Authority
JP
Japan
Prior art keywords
film
terminals
openings
resin
electrode terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3036679A
Other languages
Japanese (ja)
Other versions
JPS5824012B2 (en
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54030366A priority Critical patent/JPS5824012B2/en
Publication of JPS55121663A publication Critical patent/JPS55121663A/en
Publication of JPS5824012B2 publication Critical patent/JPS5824012B2/en
Expired legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W70/093—
    • H10W72/00—
    • H10W72/0198—
    • H10W70/09—
    • H10W70/60—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To provide a package having high reliability, thin shape, and lead terminals reduced in size by forming lead electrodes connected to the electrode terminals of an external circuit from electrode terminals of an IC, an LSI or the like by a plating method. CONSTITUTION:The first opening 2 is formed at a resin film 1, the first metal film 3 is adhered onto the film 1, and the second openings 6 are formed in the vicinity of the electrode terminals 5 of a semiconductor element 4 at the film 3. Then, adhesive thermost resin 7 is coated on the surface of the element 4, the openings 6 are positioned with the electrode terminals 5 to thermally press the film 3 onto the element 4, and the exposed resin 7 of the openings 6 is opened to expose the terminals 5. Then, the second metal film 8 is vacuum evaporated thereon, photosensitive resin film 9 is coated on the film 8, and a rectangular pattern 9 extended to the film 1 including the openings 6' in the vicinity of the terminals 5 is photoetched. After the third metal film 10 is plated on the exposed surface of the film 8 of the pattern 9', the resin film 9 and the metal films 3, 8 are etched and removed to form electrode leads from the metal film 10.
JP54030366A 1979-03-14 1979-03-14 Manufacturing method of mounting body Expired JPS5824012B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54030366A JPS5824012B2 (en) 1979-03-14 1979-03-14 Manufacturing method of mounting body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54030366A JPS5824012B2 (en) 1979-03-14 1979-03-14 Manufacturing method of mounting body

Publications (2)

Publication Number Publication Date
JPS55121663A true JPS55121663A (en) 1980-09-18
JPS5824012B2 JPS5824012B2 (en) 1983-05-18

Family

ID=12301858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54030366A Expired JPS5824012B2 (en) 1979-03-14 1979-03-14 Manufacturing method of mounting body

Country Status (1)

Country Link
JP (1) JPS5824012B2 (en)

Also Published As

Publication number Publication date
JPS5824012B2 (en) 1983-05-18

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