JPS55118654A - Manufacture of high density circuit substrate - Google Patents

Manufacture of high density circuit substrate

Info

Publication number
JPS55118654A
JPS55118654A JP2649179A JP2649179A JPS55118654A JP S55118654 A JPS55118654 A JP S55118654A JP 2649179 A JP2649179 A JP 2649179A JP 2649179 A JP2649179 A JP 2649179A JP S55118654 A JPS55118654 A JP S55118654A
Authority
JP
Japan
Prior art keywords
hole
film
high density
sheet
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2649179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337518B2 (enrdf_load_stackoverflow
Inventor
Nobuo Kamehara
Seiichi Yamada
Koichi Niwa
Kyohei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2649179A priority Critical patent/JPS55118654A/ja
Publication of JPS55118654A publication Critical patent/JPS55118654A/ja
Publication of JPS6337518B2 publication Critical patent/JPS6337518B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2649179A 1979-03-07 1979-03-07 Manufacture of high density circuit substrate Granted JPS55118654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2649179A JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2649179A JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Publications (2)

Publication Number Publication Date
JPS55118654A true JPS55118654A (en) 1980-09-11
JPS6337518B2 JPS6337518B2 (enrdf_load_stackoverflow) 1988-07-26

Family

ID=12194961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2649179A Granted JPS55118654A (en) 1979-03-07 1979-03-07 Manufacture of high density circuit substrate

Country Status (1)

Country Link
JP (1) JPS55118654A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0748261A4 (en) * 1992-03-30 1995-02-15 Vistatech Corp MULTILAYER CHIP STRUCTURE

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5064768A (enrdf_load_stackoverflow) * 1973-10-12 1975-06-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5064768A (enrdf_load_stackoverflow) * 1973-10-12 1975-06-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0748261A4 (en) * 1992-03-30 1995-02-15 Vistatech Corp MULTILAYER CHIP STRUCTURE

Also Published As

Publication number Publication date
JPS6337518B2 (enrdf_load_stackoverflow) 1988-07-26

Similar Documents

Publication Publication Date Title
SE8302619D0 (sv) Forfarande och anordning for framstellning av kopplingsplattor
JPS55118654A (en) Manufacture of high density circuit substrate
JPS52149076A (en) Semiconductor integrated circuit and its preparing method
JPS52124171A (en) Method of producing multilayer printed circuit substrate
JPS5210063A (en) Method for manufacturing electron tube
JPS5358669A (en) Method of producing printed substrate having insulating film
JPS561378A (en) Cover glass for clock
EP0136534A3 (en) Method of forming a large surface area integrated circuit
JPS52132376A (en) Method of producing printed circuit substrate with metallic core
JPS54124671A (en) Production of fluorescent display tube
JPS56123879A (en) Thick film circuit substrate
JPS52124172A (en) Method of producing printed circuit substrate
JPS52138671A (en) Method of producing printed circuit substrate
JPS5390954A (en) Photo circuit element
JPS5538018A (en) Multi-layer wiring structure
JPS52137667A (en) Method of producing thick film circuit substrate
JPS5297166A (en) Method of producing thick multilayer circuit substrate
JPS5546586A (en) Semiconductor device
JPS56118307A (en) Manufacture of inductance for thick film integrated circuit
JPS52111661A (en) Method of forming through hole of multilayer printed circuit substrate
JPS52121775A (en) Method of producing printed circuit substrate
JPS55118644A (en) Method of forming plural adjacent bonding pads
JPS5312084A (en) Method of producing printed circuit substrate original drawing
JPS5310865A (en) Method of forming thin film on printed circuit substrate
JPS5288771A (en) Method of producing photographic original drawing for printed circuit board