JPS55118654A - Manufacture of high density circuit substrate - Google Patents
Manufacture of high density circuit substrateInfo
- Publication number
- JPS55118654A JPS55118654A JP2649179A JP2649179A JPS55118654A JP S55118654 A JPS55118654 A JP S55118654A JP 2649179 A JP2649179 A JP 2649179A JP 2649179 A JP2649179 A JP 2649179A JP S55118654 A JPS55118654 A JP S55118654A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- film
- high density
- sheet
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 4
- 229920002799 BoPET Polymers 0.000 abstract 3
- 239000005041 Mylar™ Substances 0.000 abstract 3
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To provide a high density circuit substrate by burying conductive paste in a groove provided with photosensitive film laminated on a Mylar film, perforating a through hole at the film after forming a green sheet, burying the paste in the hole, separating the Mylar film and laminating the sheet thus obtained. CONSTITUTION:A photosensitive film 1 is laminated on a Mylar film 2, exposed with light, developed, and a groove 5 for a conductor circuit is formed thereon. After a conductor paste 6 is buried in the groove 5 by means of screen printing process or the like, a ceramic sheet 7 is formed as a green sheet on the film 1. A fine through hole 8 is perforated for a vertical hole by a laser or the like, and the paste is filled in the hole as a conductive hole 9. By separating the film 2 there obtained a sheet 7' having a fine conductor circuit 6 and the hole 9. The sheet 7' is then laminated, calcined, and a high density circuit substrate is formed. Accordingly, a fine conductor circuit width can be obtained to carry high density integrated element thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2649179A JPS55118654A (en) | 1979-03-07 | 1979-03-07 | Manufacture of high density circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2649179A JPS55118654A (en) | 1979-03-07 | 1979-03-07 | Manufacture of high density circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55118654A true JPS55118654A (en) | 1980-09-11 |
JPS6337518B2 JPS6337518B2 (en) | 1988-07-26 |
Family
ID=12194961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2649179A Granted JPS55118654A (en) | 1979-03-07 | 1979-03-07 | Manufacture of high density circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55118654A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0748261A4 (en) * | 1992-03-30 | 1995-02-15 | Vistatech Corp | Layered chip structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5064768A (en) * | 1973-10-12 | 1975-06-02 |
-
1979
- 1979-03-07 JP JP2649179A patent/JPS55118654A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5064768A (en) * | 1973-10-12 | 1975-06-02 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0748261A4 (en) * | 1992-03-30 | 1995-02-15 | Vistatech Corp | Layered chip structure |
EP0748261A1 (en) * | 1992-03-30 | 1996-12-18 | Vistatech Corporation | Layered chip structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6337518B2 (en) | 1988-07-26 |
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