JPS52111661A - Method of forming through hole of multilayer printed circuit substrate - Google Patents

Method of forming through hole of multilayer printed circuit substrate

Info

Publication number
JPS52111661A
JPS52111661A JP2811176A JP2811176A JPS52111661A JP S52111661 A JPS52111661 A JP S52111661A JP 2811176 A JP2811176 A JP 2811176A JP 2811176 A JP2811176 A JP 2811176A JP S52111661 A JPS52111661 A JP S52111661A
Authority
JP
Japan
Prior art keywords
hole
forming
printed circuit
circuit substrate
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2811176A
Other languages
Japanese (ja)
Inventor
Ritsushi Toba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2811176A priority Critical patent/JPS52111661A/en
Publication of JPS52111661A publication Critical patent/JPS52111661A/en
Pending legal-status Critical Current

Links

JP2811176A 1976-03-17 1976-03-17 Method of forming through hole of multilayer printed circuit substrate Pending JPS52111661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2811176A JPS52111661A (en) 1976-03-17 1976-03-17 Method of forming through hole of multilayer printed circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2811176A JPS52111661A (en) 1976-03-17 1976-03-17 Method of forming through hole of multilayer printed circuit substrate

Publications (1)

Publication Number Publication Date
JPS52111661A true JPS52111661A (en) 1977-09-19

Family

ID=12239693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2811176A Pending JPS52111661A (en) 1976-03-17 1976-03-17 Method of forming through hole of multilayer printed circuit substrate

Country Status (1)

Country Link
JP (1) JPS52111661A (en)

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