JPS551181A - Method of producing complementary mis integrated circuit apparatus - Google Patents
Method of producing complementary mis integrated circuit apparatusInfo
- Publication number
- JPS551181A JPS551181A JP4535779A JP4535779A JPS551181A JP S551181 A JPS551181 A JP S551181A JP 4535779 A JP4535779 A JP 4535779A JP 4535779 A JP4535779 A JP 4535779A JP S551181 A JPS551181 A JP S551181A
- Authority
- JP
- Japan
- Prior art keywords
- section
- film
- oxide film
- polycrystal
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To produce a MISIC containing a thin film resistor made of a polycrystal Si by setting the polycrystal at a desired resistance value by a impurity ion implantation method. CONSTITUTION:An oxide film is formed on a n-type Si substrate 1 on which a p well region and a polycrystal Si layer 8 is formed on an oxide film 7 made at the formation of the well. Then, all parts are removed only leaving the gate and the portions 8a to 8c serving as the variable resistance section. An ion implantation is conducted at the variable resistance section 8c to obtain the desired resistance value. The oxide films 7a and 7c is removed with portion corresponding to the source and drain and well regions 23 with the portions 8a to 8c as a mask. Then, an oxide film 9 is applied and the film is removed in the portion corresponding to the p-channel MOSFET forming section. The source, drain regions 10 and 11, a electrode withdrawing section 24, and the both ends 8c1 to 8c2 of the resistance section 8c are transformed to a p-type high density impurity region. Then, after the removal of the film, an oxide film 13 is formed. The film is removed from the n-channel MOSFET section and source and drain regions 14 and 15 are formed to make the gate electrode section 8a a n<+> type.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54045357A JPS5829626B2 (en) | 1979-04-16 | 1979-04-16 | Method for manufacturing complementary MIS integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54045357A JPS5829626B2 (en) | 1979-04-16 | 1979-04-16 | Method for manufacturing complementary MIS integrated circuit device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11582373A Division JPS5321992B2 (en) | 1973-10-17 | 1973-10-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS551181A true JPS551181A (en) | 1980-01-07 |
JPS5829626B2 JPS5829626B2 (en) | 1983-06-23 |
Family
ID=12717024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54045357A Expired JPS5829626B2 (en) | 1979-04-16 | 1979-04-16 | Method for manufacturing complementary MIS integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5829626B2 (en) |
-
1979
- 1979-04-16 JP JP54045357A patent/JPS5829626B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5829626B2 (en) | 1983-06-23 |
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