JPS55113372A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS55113372A JPS55113372A JP1980079A JP1980079A JPS55113372A JP S55113372 A JPS55113372 A JP S55113372A JP 1980079 A JP1980079 A JP 1980079A JP 1980079 A JP1980079 A JP 1980079A JP S55113372 A JPS55113372 A JP S55113372A
- Authority
- JP
- Japan
- Prior art keywords
- film
- schottky barrier
- constitution
- barrier
- sbd2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000004888 barrier function Effects 0.000 abstract 7
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain more effective utilization of Schottky barrier diode in case of necessity thereof which needs lower forward voltage by a constitution wherein two kinds of Schottky barrier diodes which have different barrier height with each other are formed on a single semiconductor chip. CONSTITUTION:On a part of the oxide film 5 which lies on a n<->-type epitaxial semiconductor layer 1, the opening for contact is provided and a Pt film 6 is applied on the over all surface. Next thereto Pt on the film 5 is removed after the formation of the Pt-Si barrier 2 on the surface of the substrate. Next thereto on the other part of the film 5 the contact hole 8 is formed. Next thereto the TiW film 3 is applied on the overall surface and next thereto the Al film 4 is applied. And next thereto the expected Al electrode is formed by photo etching and thus two kinds of Schottky barrier diodes SBD1 and SBD2 are completed. By this constitution, the barrier height phiB is estimated to be 0.85-0.87eV for SBD1, and 0.70-0.50eV for SBD2 and the Schottky barrier diode of lower phiB than that made of Pt-Si is made available.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980079A JPS55113372A (en) | 1979-02-23 | 1979-02-23 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980079A JPS55113372A (en) | 1979-02-23 | 1979-02-23 | Semiconductor device and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55113372A true JPS55113372A (en) | 1980-09-01 |
Family
ID=12009414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980079A Pending JPS55113372A (en) | 1979-02-23 | 1979-02-23 | Semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55113372A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119757A (en) * | 1982-12-20 | 1984-07-11 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Integrated circuit and method of producing same |
US4898838A (en) * | 1985-10-16 | 1990-02-06 | Texas Instruments Incorporated | Method for fabricating a poly emitter logic array |
US4982244A (en) * | 1982-12-20 | 1991-01-01 | National Semiconductor Corporation | Buried Schottky clamped transistor |
US5140383A (en) * | 1989-01-19 | 1992-08-18 | Texas Instruments Incorporated | Method for fabricating a buried Schottky logic array and apparatus produced thereby |
US5154514A (en) * | 1991-08-29 | 1992-10-13 | International Business Machines Corporation | On-chip temperature sensor utilizing a Schottky barrier diode structure |
US5200349A (en) * | 1980-12-30 | 1993-04-06 | Fujitsu Limited | Semiconductor device including schotky gate of silicide and method for the manufacture of the same |
US5416354A (en) * | 1989-01-06 | 1995-05-16 | Unitrode Corporation | Inverted epitaxial process semiconductor devices |
US5536967A (en) * | 1980-12-30 | 1996-07-16 | Fujitsu Limited | Semiconductor device including Schottky gate of silicide and method for the manufacture of the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5055278A (en) * | 1973-09-12 | 1975-05-15 | ||
JPS51111084A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Semiconductor device manufucturing proceso |
-
1979
- 1979-02-23 JP JP1980079A patent/JPS55113372A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5055278A (en) * | 1973-09-12 | 1975-05-15 | ||
JPS51111084A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Semiconductor device manufucturing proceso |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5200349A (en) * | 1980-12-30 | 1993-04-06 | Fujitsu Limited | Semiconductor device including schotky gate of silicide and method for the manufacture of the same |
US5536967A (en) * | 1980-12-30 | 1996-07-16 | Fujitsu Limited | Semiconductor device including Schottky gate of silicide and method for the manufacture of the same |
JPS59119757A (en) * | 1982-12-20 | 1984-07-11 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Integrated circuit and method of producing same |
US4982244A (en) * | 1982-12-20 | 1991-01-01 | National Semiconductor Corporation | Buried Schottky clamped transistor |
US4898838A (en) * | 1985-10-16 | 1990-02-06 | Texas Instruments Incorporated | Method for fabricating a poly emitter logic array |
US5416354A (en) * | 1989-01-06 | 1995-05-16 | Unitrode Corporation | Inverted epitaxial process semiconductor devices |
US5140383A (en) * | 1989-01-19 | 1992-08-18 | Texas Instruments Incorporated | Method for fabricating a buried Schottky logic array and apparatus produced thereby |
US5154514A (en) * | 1991-08-29 | 1992-10-13 | International Business Machines Corporation | On-chip temperature sensor utilizing a Schottky barrier diode structure |
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