JPS55108755A - Resin seal type semiconductor device - Google Patents
Resin seal type semiconductor deviceInfo
- Publication number
- JPS55108755A JPS55108755A JP1664579A JP1664579A JPS55108755A JP S55108755 A JPS55108755 A JP S55108755A JP 1664579 A JP1664579 A JP 1664579A JP 1664579 A JP1664579 A JP 1664579A JP S55108755 A JPS55108755 A JP S55108755A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- wire
- semiconductor device
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1664579A JPS55108755A (en) | 1979-02-14 | 1979-02-14 | Resin seal type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1664579A JPS55108755A (en) | 1979-02-14 | 1979-02-14 | Resin seal type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55108755A true JPS55108755A (en) | 1980-08-21 |
Family
ID=11922079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1664579A Pending JPS55108755A (en) | 1979-02-14 | 1979-02-14 | Resin seal type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55108755A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
JPS63211658A (ja) * | 1987-02-26 | 1988-09-02 | Nec Corp | 半導体装置 |
-
1979
- 1979-02-14 JP JP1664579A patent/JPS55108755A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
JPS6227750B2 (ja) * | 1981-05-18 | 1987-06-16 | Matsushita Electronics Corp | |
JPS63211658A (ja) * | 1987-02-26 | 1988-09-02 | Nec Corp | 半導体装置 |
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