JPS55104481A - Etching fluid for tin-nickel alloy - Google Patents

Etching fluid for tin-nickel alloy

Info

Publication number
JPS55104481A
JPS55104481A JP1084479A JP1084479A JPS55104481A JP S55104481 A JPS55104481 A JP S55104481A JP 1084479 A JP1084479 A JP 1084479A JP 1084479 A JP1084479 A JP 1084479A JP S55104481 A JPS55104481 A JP S55104481A
Authority
JP
Japan
Prior art keywords
less
acid
pref
etching fluid
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1084479A
Other languages
Japanese (ja)
Inventor
Takeshi Tsunohashi
Kazuo Fukunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP1084479A priority Critical patent/JPS55104481A/en
Priority to US06/117,692 priority patent/US4283248A/en
Publication of JPS55104481A publication Critical patent/JPS55104481A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To provide an etching fluid, which causes practically no corrosion on coexistent copper, and which etches selectively Sn-Ni alloy only, by composing a heated aq. soln. or a molten liq. of pyosphoric acid, and phrophosphoric acid or phosphorous acid. CONSTITUTION:The etching fluid is a heated aq. soln. consisting of not less than 0.1mol/l, pref., not less than 0.2mol/l phosphoric acid, not less than 0.05mol/l, pref., not less than 0.1mol/l pyrophosphoric acid, or not less than 0.1mol/l, pref., not less than 0.2mol/l phosphorous acid, or a molten liq. of these phosphoric acids. These etching fluids heated to a temp. not lower than 80 deg.C, pref. to a temp. 90- 95 deg.C corrode practically no copper, and etch selectively Sn-Ni alloy only. For example, Sn-Ni alloy film about 0.1mu in thickness, 25OMEGA/cm<2> in sheet resistivity can be removed in about 30min.
JP1084479A 1979-02-01 1979-02-01 Etching fluid for tin-nickel alloy Pending JPS55104481A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1084479A JPS55104481A (en) 1979-02-01 1979-02-01 Etching fluid for tin-nickel alloy
US06/117,692 US4283248A (en) 1979-02-01 1980-02-01 Etching solution for tin-nickel alloy and process for etching the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1084479A JPS55104481A (en) 1979-02-01 1979-02-01 Etching fluid for tin-nickel alloy

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7364083A Division JPS58193372A (en) 1983-04-25 1983-04-25 Liquid etchant for tin-nickel alloy

Publications (1)

Publication Number Publication Date
JPS55104481A true JPS55104481A (en) 1980-08-09

Family

ID=11761652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1084479A Pending JPS55104481A (en) 1979-02-01 1979-02-01 Etching fluid for tin-nickel alloy

Country Status (1)

Country Link
JP (1) JPS55104481A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7591956B2 (en) * 2006-05-03 2009-09-22 OMG Electronic Chemicals, Inc. Method and composition for selectively stripping nickel from a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7591956B2 (en) * 2006-05-03 2009-09-22 OMG Electronic Chemicals, Inc. Method and composition for selectively stripping nickel from a substrate

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