JPS57130455A - Prevention of electrolytic corrosion at junction between different metals in electric parts - Google Patents
Prevention of electrolytic corrosion at junction between different metals in electric partsInfo
- Publication number
- JPS57130455A JPS57130455A JP1491981A JP1491981A JPS57130455A JP S57130455 A JPS57130455 A JP S57130455A JP 1491981 A JP1491981 A JP 1491981A JP 1491981 A JP1491981 A JP 1491981A JP S57130455 A JPS57130455 A JP S57130455A
- Authority
- JP
- Japan
- Prior art keywords
- junction
- outward
- brazing
- spacer
- vicinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To prevent contamination on a copper plate surface which is to be an electrode surface by a method wherein a junction plane between an Al product and a copper plate is formed to be protruded outward and the copper plates are joined by butting so as to be extended at its extreme circumference more outward than the junction plane and anti-corrosion treatment such as painting or the like is applied in the vicinity of the junction. CONSTITUTION:For example heat radiating fins 1 consisting of Al plates are fixed by brazing to a spacer 2 made of Al, and at the end of the spacer 2 which is extended more outward than the most outward fin, copper plates 3 which have more larger diameters than that of the spacer 2 are jointed by brazing. On one of copper plates 3 a semiconductor element 4 or the like is attached and another copper plate 3 is used as an electrode terminal. After junction is performed painting and (or) resin coking are (is) applied on the vicinity (c) of junction planes. By this method because the vicinity of junction planes is formed to be a circular groove, contamination on an electrode surface (d) can hardly occur when brazing or corrosion protecting treatment is applied, and falling-off of painting or the like also can hardly occur.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1491981A JPS604277B2 (en) | 1981-02-05 | 1981-02-05 | Method for preventing electrolytic corrosion of dissimilar metal joints in electrical parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1491981A JPS604277B2 (en) | 1981-02-05 | 1981-02-05 | Method for preventing electrolytic corrosion of dissimilar metal joints in electrical parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57130455A true JPS57130455A (en) | 1982-08-12 |
JPS604277B2 JPS604277B2 (en) | 1985-02-02 |
Family
ID=11874366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1491981A Expired JPS604277B2 (en) | 1981-02-05 | 1981-02-05 | Method for preventing electrolytic corrosion of dissimilar metal joints in electrical parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS604277B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8012780B2 (en) | 2007-08-13 | 2011-09-06 | Sumitomo Electric Industries, Ltd. | Method of fabricating semiconductor laser |
US8605769B2 (en) | 2004-12-08 | 2013-12-10 | Sumitomo Electric Industries, Ltd. | Semiconductor laser device and manufacturing method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121168U (en) * | 1985-01-18 | 1986-07-30 |
-
1981
- 1981-02-05 JP JP1491981A patent/JPS604277B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8605769B2 (en) | 2004-12-08 | 2013-12-10 | Sumitomo Electric Industries, Ltd. | Semiconductor laser device and manufacturing method thereof |
US8012780B2 (en) | 2007-08-13 | 2011-09-06 | Sumitomo Electric Industries, Ltd. | Method of fabricating semiconductor laser |
Also Published As
Publication number | Publication date |
---|---|
JPS604277B2 (en) | 1985-02-02 |
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