JPS55103752A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPS55103752A
JPS55103752A JP1146079A JP1146079A JPS55103752A JP S55103752 A JPS55103752 A JP S55103752A JP 1146079 A JP1146079 A JP 1146079A JP 1146079 A JP1146079 A JP 1146079A JP S55103752 A JPS55103752 A JP S55103752A
Authority
JP
Japan
Prior art keywords
lead frame
resin
lead
electronic component
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1146079A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Kazuo Shimizu
Keizo Otsuki
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1146079A priority Critical patent/JPS55103752A/en
Publication of JPS55103752A publication Critical patent/JPS55103752A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify shipping operation and electric character inspection, by connecting a mold part and a lead frame by means of resin at the time of resin molding, in an electronic component to be assembled by using a lead frame. CONSTITUTION:Circuit element 21 is fixed on tab 20, and it is connected by lead 19 and wire 22. When circuit element 21, wire 22 and the inner end of the lead are molded, resin linking part 12 is also formed simultaneously. Corner 4 of dam 13 is supported by supporting piece 18 extending from lead frame 9. The semiconductor device is connected to the lead frame by means of the resin linking part. Hence, it is possible to measure (+ or -)power supply and operate high-precision inspection of electric characteristics. At the same time, it is possible to handle in lead frame units, and thereby work efficiency can be increased.
JP1146079A 1979-02-05 1979-02-05 Electronic component Pending JPS55103752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1146079A JPS55103752A (en) 1979-02-05 1979-02-05 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1146079A JPS55103752A (en) 1979-02-05 1979-02-05 Electronic component

Publications (1)

Publication Number Publication Date
JPS55103752A true JPS55103752A (en) 1980-08-08

Family

ID=11778700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1146079A Pending JPS55103752A (en) 1979-02-05 1979-02-05 Electronic component

Country Status (1)

Country Link
JP (1) JPS55103752A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994895A (en) * 1988-07-11 1991-02-19 Fujitsu Limited Hybrid integrated circuit package structure
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994895A (en) * 1988-07-11 1991-02-19 Fujitsu Limited Hybrid integrated circuit package structure
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit

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