JPS5497543A - Production of plated conductor - Google Patents

Production of plated conductor

Info

Publication number
JPS5497543A
JPS5497543A JP507178A JP507178A JPS5497543A JP S5497543 A JPS5497543 A JP S5497543A JP 507178 A JP507178 A JP 507178A JP 507178 A JP507178 A JP 507178A JP S5497543 A JPS5497543 A JP S5497543A
Authority
JP
Japan
Prior art keywords
wire
conductor
dimension
plated
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP507178A
Other languages
Japanese (ja)
Other versions
JPS5723757B2 (en
Inventor
Yoshikazu Hashimoto
Kazuo Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP507178A priority Critical patent/JPS5497543A/en
Publication of JPS5497543A publication Critical patent/JPS5497543A/en
Publication of JPS5723757B2 publication Critical patent/JPS5723757B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: In production of molten metal plated conductor to be used as wiring and leading in electronic devices, thick plating is applied to Ca-Cu alloy conductor having larger diameter than the final product dimension. Then the plated conductor is drawn into wire and softened to provided soft plated conductor having the disired diameter and plating thickness.
CONSTITUTION: Copper alloy conductor essentially consisting of copper, containing 5 to 200 ppm of caclcium is fabricated into wire having diameter larger than the final wire dimension. This wire is introduced into molten metal plating bath of lead, tin, etc, to be provided with plating, the thickness of which is larger than the final plate thickness dimension. The plated wire is than drawn into wire of desired dimension and treated by continuous softening process using direct current flow heating, radiation heating or induction heating thereby to produce plated conductor.
COPYRIGHT: (C)1979,JPO&Japio
JP507178A 1978-01-19 1978-01-19 Production of plated conductor Granted JPS5497543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP507178A JPS5497543A (en) 1978-01-19 1978-01-19 Production of plated conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP507178A JPS5497543A (en) 1978-01-19 1978-01-19 Production of plated conductor

Publications (2)

Publication Number Publication Date
JPS5497543A true JPS5497543A (en) 1979-08-01
JPS5723757B2 JPS5723757B2 (en) 1982-05-20

Family

ID=11601145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP507178A Granted JPS5497543A (en) 1978-01-19 1978-01-19 Production of plated conductor

Country Status (1)

Country Link
JP (1) JPS5497543A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104064250A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Annealed circular copper wire plated with tin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104064250A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Annealed circular copper wire plated with tin
CN104064250B (en) * 2014-06-13 2016-06-15 安徽省宁国天成电工有限公司 A kind of tin plating soft circular copper wire

Also Published As

Publication number Publication date
JPS5723757B2 (en) 1982-05-20

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