JPS54113895A - Insulator supported with resin mold - Google Patents
Insulator supported with resin moldInfo
- Publication number
- JPS54113895A JPS54113895A JP2123778A JP2123778A JPS54113895A JP S54113895 A JPS54113895 A JP S54113895A JP 2123778 A JP2123778 A JP 2123778A JP 2123778 A JP2123778 A JP 2123778A JP S54113895 A JPS54113895 A JP S54113895A
- Authority
- JP
- Japan
- Prior art keywords
- insert
- resin
- resin mold
- concentration
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Insulators (AREA)
- Insulating Bodies (AREA)
Abstract
PURPOSE: To form such that concentration of electric field is not be generated and resin and insert are closely contacted, by making double insert structure in which resin insert that has thin electro-conductive layer on the surface is prepared at the outside of metal insert.
CONSTITUTION: Double insert part is formed by metal insert 1 and resin insert 6 which is molded around the metal insert, electro-conductive layer 61 is provided on the resin insert 6 by metalicon such as copper, aluminum and the like, and this is inserted in resin mold body 2 of insulator. From this structure, it can be done that peeling or cracking is hard to be generated and drop of mechanical strength or concentration of electric field is not occured even in heating and cooling cycle or others.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2123778A JPS54113895A (en) | 1978-02-25 | 1978-02-25 | Insulator supported with resin mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2123778A JPS54113895A (en) | 1978-02-25 | 1978-02-25 | Insulator supported with resin mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54113895A true JPS54113895A (en) | 1979-09-05 |
JPS6158931B2 JPS6158931B2 (en) | 1986-12-13 |
Family
ID=12049430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2123778A Granted JPS54113895A (en) | 1978-02-25 | 1978-02-25 | Insulator supported with resin mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113895A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5730217A (en) * | 1980-07-29 | 1982-02-18 | Toshiba Chem Prod | Insulator supporting device |
JP2007280712A (en) * | 2006-04-05 | 2007-10-25 | En Liang Enterprise Co Ltd | Supporting insulator |
JP2011055708A (en) * | 2010-12-20 | 2011-03-17 | Mitsubishi Electric Corp | Insulating spacer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4922385U (en) * | 1972-06-02 | 1974-02-25 | ||
JPS5025357U (en) * | 1973-06-29 | 1975-03-24 |
-
1978
- 1978-02-25 JP JP2123778A patent/JPS54113895A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4922385U (en) * | 1972-06-02 | 1974-02-25 | ||
JPS5025357U (en) * | 1973-06-29 | 1975-03-24 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5730217A (en) * | 1980-07-29 | 1982-02-18 | Toshiba Chem Prod | Insulator supporting device |
JP2007280712A (en) * | 2006-04-05 | 2007-10-25 | En Liang Enterprise Co Ltd | Supporting insulator |
JP2011055708A (en) * | 2010-12-20 | 2011-03-17 | Mitsubishi Electric Corp | Insulating spacer |
Also Published As
Publication number | Publication date |
---|---|
JPS6158931B2 (en) | 1986-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5531619B2 (en) | ||
JPS54113895A (en) | Insulator supported with resin mold | |
JPS53105177A (en) | Manufacture of semiconductor device | |
JPS5238587A (en) | Synthetic resin molded article having electro-conductive surface layer | |
JPS5224918A (en) | Process for producing copper alloy containing iron | |
JPS5224917A (en) | Copper alloy with high electric conductivity | |
JPS5310638A (en) | Method of electrodeposition | |
JPS5226167A (en) | Connection method of the aluminium wires with the layer conductive | |
JPS5221212A (en) | Mold copper material having high heat conductivity | |
JPS51139522A (en) | Au-alloy | |
JPS5430485A (en) | Insulating treatment of electric conductor | |
JPS5321026A (en) | Electroconductive aluminum alloy | |
JPS5544836A (en) | Mold and method of producing same | |
JPS51115691A (en) | Structure for electric conduction | |
JPS52114984A (en) | Surface treatment of insulated electric conductor | |
JPS51116854A (en) | Tracking resistant resin compositions | |
JPS5291189A (en) | Manufacturing method of plastic cable connection part | |
JPS52114983A (en) | Surface treatment of insulated electric conductor | |
JPS569390A (en) | Electrolytic surface treatment of metal member | |
JPS5396037A (en) | Anticorrosive coating | |
JPS5224916A (en) | Copper alloy with high electric conductivity | |
JPS52115712A (en) | Age hardening al alloy having excellent forming property and corrosion resistance | |
JPS51120508A (en) | Process of molding of insulated wall | |
GHANDOUR | MECHANISCHE SPANNUNGSZUSTAENDE...(MECHANICAL STRESS STATES DURING ELECTROLYTIC DEPOSITION OF COPPER-NICKEL ALLOYS ON COPPER SUBSTRATES AND THE EFFECT OF ADDITIVES) | |
JPS544383A (en) | Production method of enamel-insulate wire |