JPS5497374A - Exposure method of semiconductor substrate - Google Patents

Exposure method of semiconductor substrate

Info

Publication number
JPS5497374A
JPS5497374A JP491878A JP491878A JPS5497374A JP S5497374 A JPS5497374 A JP S5497374A JP 491878 A JP491878 A JP 491878A JP 491878 A JP491878 A JP 491878A JP S5497374 A JPS5497374 A JP S5497374A
Authority
JP
Japan
Prior art keywords
substrate
masks
same
mask
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP491878A
Other languages
Japanese (ja)
Inventor
Kenzo Tokuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP491878A priority Critical patent/JPS5497374A/en
Publication of JPS5497374A publication Critical patent/JPS5497374A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Abstract

PURPOSE: To form patterns on both sides of a substrate at the same time by inserting the substrate after positioning two masks of the same chip size with the same pattern and by exposing both the sides after positioning the substrate to one mask.
CONSTITUTION: Masks 2 and 3 of the same size with the positioning pattern at the same positions are fixed to holders 10 and 11 and mask 2 is turned and moved by regulator 12 so that targets 6 and 7 will agree with targets 8 and 9 by using microscopes 4 and 5 and comparator 13. Next, semiconductor substrate 1 is inserted between the masks while being fixed to holder 14 and positions of the pattern on substrate 1 and that of mask 2 are adjusted 15 through microscope 4. Then, both the sides are exposed to print patterns on photosensitive materials. Since both photo masks have been positioned, they are effective to element on both the surface at the time of dividing the substrate into chips, so that a highly-integrated element can be obtained.
COPYRIGHT: (C)1979,JPO&Japio
JP491878A 1978-01-19 1978-01-19 Exposure method of semiconductor substrate Pending JPS5497374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP491878A JPS5497374A (en) 1978-01-19 1978-01-19 Exposure method of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP491878A JPS5497374A (en) 1978-01-19 1978-01-19 Exposure method of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5497374A true JPS5497374A (en) 1979-08-01

Family

ID=11596992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP491878A Pending JPS5497374A (en) 1978-01-19 1978-01-19 Exposure method of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5497374A (en)

Similar Documents

Publication Publication Date Title
JPS5754317A (en) Method and device for forming pattern
JPS57204547A (en) Exposing method
JPS5569265A (en) Pattern-forming method
JPS5799639A (en) Treatment of negative type resist
JPS57183031A (en) Method for wafer exposure and device thereof
JPS57183032A (en) Method for wafer exposure and device thereof
JPS5497374A (en) Exposure method of semiconductor substrate
JPS5492061A (en) Micropattern forming method
JPS54141573A (en) Mask for exposure
JPS5431282A (en) Pattern formation method
JPS569742A (en) Developing method of photosensitive resin
JPS5211868A (en) Photoresist coating method
JPS5277671A (en) Method and equipment of masking
JPS5931852B2 (en) Photoresist exposure mask
JPS5339060A (en) Lot number marking method to wafers
JPS5748233A (en) Exposure system for semiconductor substance
JPS57183033A (en) Method for wafer exposure and device thereof
JPS5255867A (en) Exposure method
JPS5491183A (en) Production of semiconductor device
JPS554982A (en) Semiconductor device manufacturing method using automatic exposure capable of fitting pattern
JPS57114251A (en) Manufacture of semiconductor device
JPS5546559A (en) Method of fabricating semiconductor device
JPS5254377A (en) Electron beam exposure method
JPS5359370A (en) Positioning method
JPS5616126A (en) Exposing method