JPS5497374A - Exposure method of semiconductor substrate - Google Patents
Exposure method of semiconductor substrateInfo
- Publication number
- JPS5497374A JPS5497374A JP491878A JP491878A JPS5497374A JP S5497374 A JPS5497374 A JP S5497374A JP 491878 A JP491878 A JP 491878A JP 491878 A JP491878 A JP 491878A JP S5497374 A JPS5497374 A JP S5497374A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- masks
- same
- mask
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
Abstract
PURPOSE: To form patterns on both sides of a substrate at the same time by inserting the substrate after positioning two masks of the same chip size with the same pattern and by exposing both the sides after positioning the substrate to one mask.
CONSTITUTION: Masks 2 and 3 of the same size with the positioning pattern at the same positions are fixed to holders 10 and 11 and mask 2 is turned and moved by regulator 12 so that targets 6 and 7 will agree with targets 8 and 9 by using microscopes 4 and 5 and comparator 13. Next, semiconductor substrate 1 is inserted between the masks while being fixed to holder 14 and positions of the pattern on substrate 1 and that of mask 2 are adjusted 15 through microscope 4. Then, both the sides are exposed to print patterns on photosensitive materials. Since both photo masks have been positioned, they are effective to element on both the surface at the time of dividing the substrate into chips, so that a highly-integrated element can be obtained.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP491878A JPS5497374A (en) | 1978-01-19 | 1978-01-19 | Exposure method of semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP491878A JPS5497374A (en) | 1978-01-19 | 1978-01-19 | Exposure method of semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5497374A true JPS5497374A (en) | 1979-08-01 |
Family
ID=11596992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP491878A Pending JPS5497374A (en) | 1978-01-19 | 1978-01-19 | Exposure method of semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5497374A (en) |
-
1978
- 1978-01-19 JP JP491878A patent/JPS5497374A/en active Pending
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