JPS5474248A - Clad solder - Google Patents
Clad solderInfo
- Publication number
- JPS5474248A JPS5474248A JP14104877A JP14104877A JPS5474248A JP S5474248 A JPS5474248 A JP S5474248A JP 14104877 A JP14104877 A JP 14104877A JP 14104877 A JP14104877 A JP 14104877A JP S5474248 A JPS5474248 A JP S5474248A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- sides
- rich
- clad solder
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 4
- 239000000956 alloy Substances 0.000 abstract 4
- 229910020220 Pb—Sn Inorganic materials 0.000 abstract 2
- 229910020816 Sn Pb Inorganic materials 0.000 abstract 2
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract 2
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 230000009257 reactivity Effects 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14104877A JPS5474248A (en) | 1977-11-24 | 1977-11-24 | Clad solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14104877A JPS5474248A (en) | 1977-11-24 | 1977-11-24 | Clad solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5474248A true JPS5474248A (en) | 1979-06-14 |
| JPS6125471B2 JPS6125471B2 (enExample) | 1986-06-16 |
Family
ID=15283028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14104877A Granted JPS5474248A (en) | 1977-11-24 | 1977-11-24 | Clad solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5474248A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59209500A (ja) * | 1983-05-12 | 1984-11-28 | Hitachi Cable Ltd | 銅−半田クラツド材 |
| JPS6471591A (en) * | 1987-09-09 | 1989-03-16 | Sumitomo Spec Metals | Joining method for metal or alloy piece |
| US5045410A (en) * | 1985-12-13 | 1991-09-03 | Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung | Low phosphorus containing band-shaped and/or filamentary material |
| JPH04270092A (ja) * | 1991-01-21 | 1992-09-25 | Mitsubishi Electric Corp | 半田材料及び接合方法 |
-
1977
- 1977-11-24 JP JP14104877A patent/JPS5474248A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59209500A (ja) * | 1983-05-12 | 1984-11-28 | Hitachi Cable Ltd | 銅−半田クラツド材 |
| US5045410A (en) * | 1985-12-13 | 1991-09-03 | Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung | Low phosphorus containing band-shaped and/or filamentary material |
| JPS6471591A (en) * | 1987-09-09 | 1989-03-16 | Sumitomo Spec Metals | Joining method for metal or alloy piece |
| JPH04270092A (ja) * | 1991-01-21 | 1992-09-25 | Mitsubishi Electric Corp | 半田材料及び接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6125471B2 (enExample) | 1986-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY114565A (en) | Lead-free solder alloys | |
| TW363334B (en) | Lead-free, tin based solder composition | |
| KR19980068127A (ko) | 납땜용 무연 합금 | |
| ATE269776T1 (de) | Bleifreies lot | |
| MY130764A (en) | Menthod of producing an electronic device having a pb free solder connection, pb-free solder-connected structure and electronic device | |
| JP3879582B2 (ja) | ソルダペースト、電子部品およびステップ・ソルダリング方法 | |
| JPS5474248A (en) | Clad solder | |
| KR840005986A (ko) | 균질한 저융점 구리기초 합금. | |
| CN1066999A (zh) | 一种无银铜基钎料 | |
| DE3315498A1 (de) | Schichtverbund-kontaktstueck | |
| JPS54159173A (en) | Construction of bump electrode | |
| JPS56109157A (en) | Brazed structural body of al material and cu material | |
| JPS5596662A (en) | Electronic component member | |
| JPS56144893A (en) | Solder alloy for fitting lead on silver electrode | |
| JPS54100941A (en) | Low temperature fusion plating material | |
| JPS5575893A (en) | Production of solder | |
| US4080203A (en) | Silver base brazing alloy | |
| JPS5550995A (en) | Delustered solder | |
| JPS57127596A (en) | Metallic solder | |
| JPS56127742A (en) | Cu-mn alloy solder material free from generation of pinhole deficiency | |
| JPS5732346A (en) | Mother alloy for oxidation resistant lead-tin solder | |
| KR100194147B1 (ko) | 무연땜납합금 | |
| JPS5684432A (en) | Gold brazing material | |
| JPS5447845A (en) | Low melting point copper alloys for welding and soldering | |
| 홍순국 et al. | Pb Free Sn-2% Ag-x% Bi] Solder 9) 543o] ik 9łº |