JPS5465476A - Semiconductor rectifying device - Google Patents
Semiconductor rectifying deviceInfo
- Publication number
- JPS5465476A JPS5465476A JP13156877A JP13156877A JPS5465476A JP S5465476 A JPS5465476 A JP S5465476A JP 13156877 A JP13156877 A JP 13156877A JP 13156877 A JP13156877 A JP 13156877A JP S5465476 A JPS5465476 A JP S5465476A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- header
- soldered
- semiconductor chip
- rectifying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000005338 heat storage Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5465476A true JPS5465476A (en) | 1979-05-26 |
JPS6248387B2 JPS6248387B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-13 |
Family
ID=15061094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13156877A Granted JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5465476A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1977
- 1977-11-04 JP JP13156877A patent/JPS5465476A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6248387B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5465476A (en) | Semiconductor rectifying device | |
JPS5610938A (en) | Press-fit type semiconductor device | |
JPS57112055A (en) | Integrated circuit package | |
JPS5599731A (en) | Method of assembling electronic device and lead frame used for assembly | |
JPS5422162A (en) | Manufacture of semiconductor device | |
JPS54146986A (en) | Package for semiconductor device | |
JPS56115550A (en) | Manufacture of semiconductor device | |
JPS5374367A (en) | Semiconductor device | |
JPS5480679A (en) | Manufacture for semiconductor device | |
JPS5662342A (en) | Semiconductor device | |
JPS56147453A (en) | Semiconductor device | |
JPS53124072A (en) | Semiconductor device | |
JPS53141575A (en) | Semiconductor device | |
JPS56114338A (en) | Semiconductor device | |
JPS54868A (en) | Semiconductor device | |
JPS5793535A (en) | Semiconductor device | |
JPS5487182A (en) | Package for semiconductor device | |
JPS5317274A (en) | Electrode structure of semiconductor element | |
JPS5571045A (en) | Lead frame | |
JPS5669839A (en) | Semiconductor device and manufacture thereof | |
JPS53121462A (en) | Semiconductor device | |
JPS55153360A (en) | Glass sealing type semiconductor device | |
JPS5451477A (en) | Mounting method of semiconductor chip | |
JPS544067A (en) | Electrode forming method of semiconductor device | |
JPS5429974A (en) | Semiconductor device of resin sealing type |