JPS6248387B2 - - Google Patents
Info
- Publication number
- JPS6248387B2 JPS6248387B2 JP13156877A JP13156877A JPS6248387B2 JP S6248387 B2 JPS6248387 B2 JP S6248387B2 JP 13156877 A JP13156877 A JP 13156877A JP 13156877 A JP13156877 A JP 13156877A JP S6248387 B2 JPS6248387 B2 JP S6248387B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- header
- semiconductor
- lead wire
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 39
- 238000005219 brazing Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 230000001154 acute effect Effects 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 206010016256 fatigue Diseases 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5465476A JPS5465476A (en) | 1979-05-26 |
| JPS6248387B2 true JPS6248387B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-13 |
Family
ID=15061094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13156877A Granted JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5465476A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1977
- 1977-11-04 JP JP13156877A patent/JPS5465476A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5465476A (en) | 1979-05-26 |
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