JPS5465476A - Semiconductor rectifying device - Google Patents

Semiconductor rectifying device

Info

Publication number
JPS5465476A
JPS5465476A JP13156877A JP13156877A JPS5465476A JP S5465476 A JPS5465476 A JP S5465476A JP 13156877 A JP13156877 A JP 13156877A JP 13156877 A JP13156877 A JP 13156877A JP S5465476 A JPS5465476 A JP S5465476A
Authority
JP
Japan
Prior art keywords
lead wire
header
soldered
semiconductor chip
rectifying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13156877A
Other languages
Japanese (ja)
Other versions
JPS6248387B2 (en
Inventor
Motoji Nakajima
Tadashi Sakagami
Kazutoyo Narita
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP13156877A priority Critical patent/JPS5465476A/en
Publication of JPS5465476A publication Critical patent/JPS5465476A/en
Publication of JPS6248387B2 publication Critical patent/JPS6248387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To decrease the number of the component parts by substituting the header of the lead wire for the copper plate. CONSTITUTION:Header 6 of the lead wire is formed into a disc or square shape with the area same as or larger than semiconductor chip 1. The material uses the copper coated with silver, and the plate thickness is set to such value through which the heat storage action may be fully utilized. Semiconductor chip 1 is then soldered (3) to the bottom of concave base 2, and header 6 of lead wire 5 is soldered (3) onto the upper surface of the chip. Then Si rubber 7 is injected, and the opening part is sealed up by sealing material 8. With use of the lead wire of such structure, the assembling work is simplified, and the parts can be set at the correct position with the uniform solder thickness secured.
JP13156877A 1977-11-04 1977-11-04 Semiconductor rectifying device Granted JPS5465476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13156877A JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13156877A JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Publications (2)

Publication Number Publication Date
JPS5465476A true JPS5465476A (en) 1979-05-26
JPS6248387B2 JPS6248387B2 (en) 1987-10-13

Family

ID=15061094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13156877A Granted JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS5465476A (en)

Also Published As

Publication number Publication date
JPS6248387B2 (en) 1987-10-13

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