JPS5464477A - Method of and device for forming electric connection from semiconductor wafer to conductive region - Google Patents

Method of and device for forming electric connection from semiconductor wafer to conductive region

Info

Publication number
JPS5464477A
JPS5464477A JP12423678A JP12423678A JPS5464477A JP S5464477 A JPS5464477 A JP S5464477A JP 12423678 A JP12423678 A JP 12423678A JP 12423678 A JP12423678 A JP 12423678A JP S5464477 A JPS5464477 A JP S5464477A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
electric connection
conductive region
forming electric
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12423678A
Other languages
English (en)
Other versions
JPS6129534B2 (ja
Inventor
Jiei Zashio Jiyon
Daburiyu Samiyueruzu Maikeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MAIKERU W SAMIYUERUZU
Original Assignee
MAIKERU W SAMIYUERUZU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MAIKERU W SAMIYUERUZU filed Critical MAIKERU W SAMIYUERUZU
Publication of JPS5464477A publication Critical patent/JPS5464477A/ja
Publication of JPS6129534B2 publication Critical patent/JPS6129534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP12423678A 1977-10-11 1978-10-11 Method of and device for forming electric connection from semiconductor wafer to conductive region Granted JPS5464477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84067477A 1977-10-11 1977-10-11

Publications (2)

Publication Number Publication Date
JPS5464477A true JPS5464477A (en) 1979-05-24
JPS6129534B2 JPS6129534B2 (ja) 1986-07-07

Family

ID=25282934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12423678A Granted JPS5464477A (en) 1977-10-11 1978-10-11 Method of and device for forming electric connection from semiconductor wafer to conductive region

Country Status (6)

Country Link
JP (1) JPS5464477A (ja)
CA (1) CA1118535A (ja)
DE (1) DE2843310C2 (ja)
FR (1) FR2406304A1 (ja)
GB (1) GB1604004A (ja)
NL (1) NL7810167A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162004A (en) * 1979-06-06 1980-12-17 Toshiba Corp Electric charge corpuscular ray irradiation unit
JPS5744543U (ja) * 1980-08-27 1982-03-11

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323638A (en) * 1980-08-18 1982-04-06 Bell Telephone Laboratories, Incorporated Reducing charging effects in charged-particle-beam lithography
US7038204B2 (en) 2004-05-26 2006-05-02 International Business Machines Corporation Method for reducing proximity effects in electron beam lithography

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3390012A (en) * 1964-05-14 1968-06-25 Texas Instruments Inc Method of making dielectric bodies having conducting portions
DE1800212A1 (de) * 1968-10-01 1970-05-06 Telefunken Patent Verfahren zum Herstellen einer Halbleiteranordnung
DE1800193A1 (de) * 1968-10-01 1970-05-14 Telefunken Patent Verfahren zum Herstellen von Kontakten
US3710101A (en) * 1970-10-06 1973-01-09 Westinghouse Electric Corp Apparatus and method for alignment of members to electron beams
JPS5183788A (en) * 1974-12-12 1976-07-22 Du Pont Daioodo oyobi kanrendodenrookeiseisurukozotai

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162004A (en) * 1979-06-06 1980-12-17 Toshiba Corp Electric charge corpuscular ray irradiation unit
JPS5744543U (ja) * 1980-08-27 1982-03-11

Also Published As

Publication number Publication date
NL7810167A (nl) 1979-04-17
DE2843310A1 (de) 1979-04-19
JPS6129534B2 (ja) 1986-07-07
FR2406304A1 (fr) 1979-05-11
CA1118535A (en) 1982-02-16
FR2406304B1 (ja) 1983-01-07
DE2843310C2 (de) 1983-06-01
GB1604004A (en) 1981-12-02

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