JPS5455181A - Production of semiconductor substrate - Google Patents
Production of semiconductor substrateInfo
- Publication number
- JPS5455181A JPS5455181A JP12146577A JP12146577A JPS5455181A JP S5455181 A JPS5455181 A JP S5455181A JP 12146577 A JP12146577 A JP 12146577A JP 12146577 A JP12146577 A JP 12146577A JP S5455181 A JPS5455181 A JP S5455181A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sio
- layer
- semiconductor substrate
- base glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Element Separation (AREA)
Abstract
PURPOSE: To obtain powerful bonding layers by laminating and growing an insulator layer and a polycrystalline semiconductor layer on a semiconductor substrate formed with isolation grooves and using B2O3-SiO2 base or P2O5-siO2 base glass at the time of bonding said polycrystalline layer on a supporting substrate.
CONSTITUTION: Isolation layers 120 ae etched in the surface of a semiconductor substrate 110 for circuit element formation, and an insulator film 130 and a polycrystalline semiconductor layer 140 are laminated and grown thereon. Next, the layer 140 is polished to flatten the surface, where a spin-on glass film 150 composed of B2O3-SiO2 base glass of 3 to 12mol% in the content of B2O3 or P2O5-SiO2 base glass containing 4 to 9mol% of P2O5 is coated. On the other hand, the same film 150 is beforehand coated also on the surface of a supporting substrate 210 to be bonded to the substrate 110 and these films 150 are superposed and thermo-compression-bonded. Thereafter, the surface of the substrate 110 is polished away down to the position shown by the dotted line A-A, whereby the insulated and isolated substrate having the single crystal islands 110a having been insulated and isolated is obtained
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12146577A JPS5455181A (en) | 1977-10-12 | 1977-10-12 | Production of semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12146577A JPS5455181A (en) | 1977-10-12 | 1977-10-12 | Production of semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5455181A true JPS5455181A (en) | 1979-05-02 |
Family
ID=14811802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12146577A Pending JPS5455181A (en) | 1977-10-12 | 1977-10-12 | Production of semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5455181A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6337652A (en) * | 1986-07-31 | 1988-02-18 | Sumitomo Metal Mining Co Ltd | Adhesion method of substrate for semiconductor device |
JPS63202035A (en) * | 1987-02-17 | 1988-08-22 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS63202034A (en) * | 1987-02-17 | 1988-08-22 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
WO1998044319A1 (en) * | 1997-04-03 | 1998-10-08 | Yamatake Corporation | Circuit board and detector, and method for manufacturing the same |
-
1977
- 1977-10-12 JP JP12146577A patent/JPS5455181A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6337652A (en) * | 1986-07-31 | 1988-02-18 | Sumitomo Metal Mining Co Ltd | Adhesion method of substrate for semiconductor device |
JPS63202035A (en) * | 1987-02-17 | 1988-08-22 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS63202034A (en) * | 1987-02-17 | 1988-08-22 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
WO1998044319A1 (en) * | 1997-04-03 | 1998-10-08 | Yamatake Corporation | Circuit board and detector, and method for manufacturing the same |
US6353262B1 (en) | 1997-04-03 | 2002-03-05 | Yamatake Corporation | Circuit substrate, detector, and method of manufacturing the same |
US6475821B2 (en) | 1997-04-03 | 2002-11-05 | Yamatake Corporation | Circuit substrate, detector, and method of manufacturing the same |
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