JPS5448646A - Copper electroplating - Google Patents

Copper electroplating

Info

Publication number
JPS5448646A
JPS5448646A JP5262178A JP5262178A JPS5448646A JP S5448646 A JPS5448646 A JP S5448646A JP 5262178 A JP5262178 A JP 5262178A JP 5262178 A JP5262178 A JP 5262178A JP S5448646 A JPS5448646 A JP S5448646A
Authority
JP
Japan
Prior art keywords
copper electroplating
electroplating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5262178A
Other languages
English (en)
Inventor
Jiyaahaado Kuruutsu Hansu
Uirubaa Haa Roi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of JPS5448646A publication Critical patent/JPS5448646A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP5262178A 1977-05-04 1978-05-01 Copper electroplating Pending JPS5448646A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
JPS5448646A true JPS5448646A (en) 1979-04-17

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5262178A Pending JPS5448646A (en) 1977-05-04 1978-05-01 Copper electroplating

Country Status (7)

Country Link
JP (1) JPS5448646A (ja)
AR (1) AR224861A1 (ja)
CA (1) CA1105045A (ja)
DE (1) DE2818725A1 (ja)
FR (1) FR2389689B1 (ja)
GB (1) GB1597519A (ja)
NL (1) NL7804874A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013522468A (ja) * 2010-03-18 2013-06-13 ビーエーエスエフ ソシエタス・ヨーロピア レベリング剤を含有する金属電解めっき用組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380259D1 (en) * 1982-12-23 1989-08-31 Procter & Gamble Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
KR102339867B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104442A (en) * 1975-03-11 1976-09-16 Oxy Metal Industries Corp Denchakuyososeibutsuoyobihoho

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104442A (en) * 1975-03-11 1976-09-16 Oxy Metal Industries Corp Denchakuyososeibutsuoyobihoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013522468A (ja) * 2010-03-18 2013-06-13 ビーエーエスエフ ソシエタス・ヨーロピア レベリング剤を含有する金属電解めっき用組成物

Also Published As

Publication number Publication date
GB1597519A (en) 1981-09-09
NL7804874A (nl) 1978-11-07
AR224861A1 (es) 1982-01-29
FR2389689B1 (ja) 1983-04-22
DE2818725A1 (de) 1978-11-16
FR2389689A1 (ja) 1978-12-01
CA1105045A (en) 1981-07-14

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