JPS5438765A - Semiconductor rectifying device - Google Patents

Semiconductor rectifying device

Info

Publication number
JPS5438765A
JPS5438765A JP10481177A JP10481177A JPS5438765A JP S5438765 A JPS5438765 A JP S5438765A JP 10481177 A JP10481177 A JP 10481177A JP 10481177 A JP10481177 A JP 10481177A JP S5438765 A JPS5438765 A JP S5438765A
Authority
JP
Japan
Prior art keywords
lead
rectifying device
semiconductor rectifying
semiconductor chip
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10481177A
Other languages
Japanese (ja)
Other versions
JPS5931986B2 (en
Inventor
Kazutoyo Narita
Tadashi Sakagami
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52104811A priority Critical patent/JPS5931986B2/en
Publication of JPS5438765A publication Critical patent/JPS5438765A/en
Publication of JPS5931986B2 publication Critical patent/JPS5931986B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Die Bonding (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE: To prevent sucking of the braze material between semiconductor chip and lead up to lead part and prevent the occurrence of thermal fatigue breakdown by using the lead having a plane part being the bonding face to the semiconductor chip and a cushion part comprised of rise portion.
COPYRIGHT: (C)1979,JPO&Japio
JP52104811A 1977-09-02 1977-09-02 semiconductor rectifier Expired JPS5931986B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52104811A JPS5931986B2 (en) 1977-09-02 1977-09-02 semiconductor rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52104811A JPS5931986B2 (en) 1977-09-02 1977-09-02 semiconductor rectifier

Publications (2)

Publication Number Publication Date
JPS5438765A true JPS5438765A (en) 1979-03-23
JPS5931986B2 JPS5931986B2 (en) 1984-08-06

Family

ID=14390789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52104811A Expired JPS5931986B2 (en) 1977-09-02 1977-09-02 semiconductor rectifier

Country Status (1)

Country Link
JP (1) JPS5931986B2 (en)

Also Published As

Publication number Publication date
JPS5931986B2 (en) 1984-08-06

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