Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP9593477ApriorityCriticalpatent/JPS5429563A/en
Publication of JPS5429563ApublicationCriticalpatent/JPS5429563A/en
PURPOSE: To increase the yield rate of the lead bonding process, by avoiding the damage of pad, through the use of measuring Al electrode separately supplied without using the bonding pad of drawing type electrode, in measuring the electrical characteristics of semiconductor elements.
COPYRIGHT: (C)1979,JPO&Japio
JP9593477A1977-08-091977-08-09Manufacture for semiconductor device
PendingJPS5429563A
(en)