JPS5422763A - Collector electrode formation for semiconductor element - Google Patents

Collector electrode formation for semiconductor element

Info

Publication number
JPS5422763A
JPS5422763A JP8738177A JP8738177A JPS5422763A JP S5422763 A JPS5422763 A JP S5422763A JP 8738177 A JP8738177 A JP 8738177A JP 8738177 A JP8738177 A JP 8738177A JP S5422763 A JPS5422763 A JP S5422763A
Authority
JP
Japan
Prior art keywords
semiconductor element
collector electrode
electrode formation
solder
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8738177A
Other languages
Japanese (ja)
Inventor
Toshimoto Mogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8738177A priority Critical patent/JPS5422763A/en
Publication of JPS5422763A publication Critical patent/JPS5422763A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce the number of the attachment processes of the semiconductor pellet as well as to prevent the crack occurrence of the solder layer, by forming deep concavities corresponding to the collectors of element of the semiconductor wafer and then supplying the solder to each collector surface via the concavity in order to form the collector solder electrode.
COPYRIGHT: (C)1979,JPO&Japio
JP8738177A 1977-07-22 1977-07-22 Collector electrode formation for semiconductor element Pending JPS5422763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8738177A JPS5422763A (en) 1977-07-22 1977-07-22 Collector electrode formation for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8738177A JPS5422763A (en) 1977-07-22 1977-07-22 Collector electrode formation for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5422763A true JPS5422763A (en) 1979-02-20

Family

ID=13913310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8738177A Pending JPS5422763A (en) 1977-07-22 1977-07-22 Collector electrode formation for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5422763A (en)

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