JPS542062A - Groove machining method for semiconductor wafer - Google Patents

Groove machining method for semiconductor wafer

Info

Publication number
JPS542062A
JPS542062A JP6750577A JP6750577A JPS542062A JP S542062 A JPS542062 A JP S542062A JP 6750577 A JP6750577 A JP 6750577A JP 6750577 A JP6750577 A JP 6750577A JP S542062 A JPS542062 A JP S542062A
Authority
JP
Japan
Prior art keywords
groove machining
semiconductor wafer
machining method
wafer
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6750577A
Other languages
Japanese (ja)
Inventor
Masakazu Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6750577A priority Critical patent/JPS542062A/en
Priority to GB23975/78A priority patent/GB1584343A/en
Priority to DE2823869A priority patent/DE2823869C2/en
Priority to US05/911,234 priority patent/US4166574A/en
Publication of JPS542062A publication Critical patent/JPS542062A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To increase the processing yield rate, by avoiding cutting trash from being attached through dropping the cutting trash of a wafer downward, through the performance of groove machining by arranging the groove machining surface of the wafer at down side.
COPYRIGHT: (C)1979,JPO&Japio
JP6750577A 1977-06-07 1977-06-07 Groove machining method for semiconductor wafer Pending JPS542062A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6750577A JPS542062A (en) 1977-06-07 1977-06-07 Groove machining method for semiconductor wafer
GB23975/78A GB1584343A (en) 1977-06-07 1978-05-30 Apparatus for marking identification symbols on wafer
DE2823869A DE2823869C2 (en) 1977-06-07 1978-05-31 Identification symbol scribing device
US05/911,234 US4166574A (en) 1977-06-07 1978-05-31 Apparatus for marking identification symbols on wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6750577A JPS542062A (en) 1977-06-07 1977-06-07 Groove machining method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS542062A true JPS542062A (en) 1979-01-09

Family

ID=13346901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6750577A Pending JPS542062A (en) 1977-06-07 1977-06-07 Groove machining method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS542062A (en)

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