JPS542062A - Groove machining method for semiconductor wafer - Google Patents
Groove machining method for semiconductor waferInfo
- Publication number
- JPS542062A JPS542062A JP6750577A JP6750577A JPS542062A JP S542062 A JPS542062 A JP S542062A JP 6750577 A JP6750577 A JP 6750577A JP 6750577 A JP6750577 A JP 6750577A JP S542062 A JPS542062 A JP S542062A
- Authority
- JP
- Japan
- Prior art keywords
- groove machining
- semiconductor wafer
- machining method
- wafer
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To increase the processing yield rate, by avoiding cutting trash from being attached through dropping the cutting trash of a wafer downward, through the performance of groove machining by arranging the groove machining surface of the wafer at down side.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6750577A JPS542062A (en) | 1977-06-07 | 1977-06-07 | Groove machining method for semiconductor wafer |
GB23975/78A GB1584343A (en) | 1977-06-07 | 1978-05-30 | Apparatus for marking identification symbols on wafer |
DE2823869A DE2823869C2 (en) | 1977-06-07 | 1978-05-31 | Identification symbol scribing device |
US05/911,234 US4166574A (en) | 1977-06-07 | 1978-05-31 | Apparatus for marking identification symbols on wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6750577A JPS542062A (en) | 1977-06-07 | 1977-06-07 | Groove machining method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS542062A true JPS542062A (en) | 1979-01-09 |
Family
ID=13346901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6750577A Pending JPS542062A (en) | 1977-06-07 | 1977-06-07 | Groove machining method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS542062A (en) |
-
1977
- 1977-06-07 JP JP6750577A patent/JPS542062A/en active Pending
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