Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to JP5895577ApriorityCriticalpatent/JPS53144258A/en
Publication of JPS53144258ApublicationCriticalpatent/JPS53144258A/en
PURPOSE: To facilitate the handling as well as to avoid the stains or injury on the surface by forming a wafer aggregate which is coupled via part of the semiconductor wafer.
COPYRIGHT: (C)1978,JPO&Japio
JP5895577A1977-05-211977-05-21Production method for semiconductor wafer
PendingJPS53144258A
(en)