JPS54182848U - - Google Patents

Info

Publication number
JPS54182848U
JPS54182848U JP1978081657U JP8165778U JPS54182848U JP S54182848 U JPS54182848 U JP S54182848U JP 1978081657 U JP1978081657 U JP 1978081657U JP 8165778 U JP8165778 U JP 8165778U JP S54182848 U JPS54182848 U JP S54182848U
Authority
JP
Japan
Prior art keywords
pattern
lead frame
conductive pattern
inductor
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978081657U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978081657U priority Critical patent/JPS54182848U/ja
Priority to CA329,399A priority patent/CA1108307A/en
Priority to US06/048,849 priority patent/US4297647A/en
Publication of JPS54182848U publication Critical patent/JPS54182848U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Amplifiers (AREA)
  • Waveguides (AREA)
JP1978081657U 1978-06-16 1978-06-16 Pending JPS54182848U (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1978081657U JPS54182848U (enExample) 1978-06-16 1978-06-16
CA329,399A CA1108307A (en) 1978-06-16 1979-06-08 Hybrid integrated circuit and a method for producing the same
US06/048,849 US4297647A (en) 1978-06-16 1979-06-15 Hybrid integrated circuit and a method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978081657U JPS54182848U (enExample) 1978-06-16 1978-06-16

Publications (1)

Publication Number Publication Date
JPS54182848U true JPS54182848U (enExample) 1979-12-25

Family

ID=13752389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978081657U Pending JPS54182848U (enExample) 1978-06-16 1978-06-16

Country Status (3)

Country Link
US (1) US4297647A (enExample)
JP (1) JPS54182848U (enExample)
CA (1) CA1108307A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8311071D0 (en) * 1983-04-22 1983-05-25 Sinclair Res Ltd Amplifier
JPH0625976Y2 (ja) * 1987-04-21 1994-07-06 テルモ株式会社 電子回路用基板接続体
EP0411341A3 (en) * 1989-07-10 1992-05-13 Yozan Inc. Neural network
US5430613A (en) * 1993-06-01 1995-07-04 Eaton Corporation Current transformer using a laminated toroidal core structure and a lead frame
US5370766A (en) * 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
JPH07211856A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd 集積回路モジュール
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
US5504370A (en) * 1994-09-15 1996-04-02 National Semiconductor Corporation Electronic system circuit package directly supporting components on isolated subsegments
US5721506A (en) * 1994-12-14 1998-02-24 Micron Technology, Inc. Efficient Vccp supply with regulation for voltage control
US6159817A (en) * 1998-05-07 2000-12-12 Electro-Films Incorporated Multi-tap thin film inductor
US6351033B1 (en) * 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
US6225684B1 (en) * 2000-02-29 2001-05-01 Texas Instruments Tucson Corporation Low temperature coefficient leadframe
TW535352B (en) * 2000-05-30 2003-06-01 Alps Electric Co Ltd Surface-mounting type electronic circuit unit
US6549077B1 (en) * 2002-02-20 2003-04-15 United Microelectronics Corp. Integrated inductor for RF transistor
US7627381B2 (en) 2004-05-07 2009-12-01 Therm Med, Llc Systems and methods for combined RF-induced hyperthermia and radioimmunotherapy
CN101777552B (zh) * 2009-12-31 2011-12-28 锐迪科科技有限公司 扼流电感

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
JPS5233453A (en) * 1975-09-10 1977-03-14 Nec Corp High frequency high output transistor amplifier

Also Published As

Publication number Publication date
US4297647A (en) 1981-10-27
CA1108307A (en) 1981-09-01

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