JPS54118573A - Circuit board with parts and method of producing same - Google Patents

Circuit board with parts and method of producing same

Info

Publication number
JPS54118573A
JPS54118573A JP12675778A JP12675778A JPS54118573A JP S54118573 A JPS54118573 A JP S54118573A JP 12675778 A JP12675778 A JP 12675778A JP 12675778 A JP12675778 A JP 12675778A JP S54118573 A JPS54118573 A JP S54118573A
Authority
JP
Japan
Prior art keywords
parts
circuit board
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12675778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639396B2 (enrdf_load_stackoverflow
Inventor
Sutaaru Eritsutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS54118573A publication Critical patent/JPS54118573A/ja
Publication of JPS639396B2 publication Critical patent/JPS639396B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP12675778A 1978-02-28 1978-10-14 Circuit board with parts and method of producing same Granted JPS54118573A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (2)

Publication Number Publication Date
JPS54118573A true JPS54118573A (en) 1979-09-14
JPS639396B2 JPS639396B2 (enrdf_load_stackoverflow) 1988-02-29

Family

ID=6033380

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12675778A Granted JPS54118573A (en) 1978-02-28 1978-10-14 Circuit board with parts and method of producing same
JP1982122152U Pending JPS58103163U (ja) 1978-02-28 1982-08-10 部品を取付けた回路板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1982122152U Pending JPS58103163U (ja) 1978-02-28 1982-08-10 部品を取付けた回路板

Country Status (9)

Country Link
JP (2) JPS54118573A (enrdf_load_stackoverflow)
AT (1) AT377889B (enrdf_load_stackoverflow)
AU (1) AU531356B2 (enrdf_load_stackoverflow)
CA (1) CA1131746A (enrdf_load_stackoverflow)
DE (1) DE2809013C2 (enrdf_load_stackoverflow)
DK (1) DK152480C (enrdf_load_stackoverflow)
IL (1) IL56306A (enrdf_load_stackoverflow)
IT (1) IT7947865A0 (enrdf_load_stackoverflow)
SE (1) SE443276B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (ja) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd トンネルの構築工法
DE4028978C2 (de) * 1990-09-12 1993-10-14 Siemens Ag Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100660A (enrdf_load_stackoverflow) * 1972-04-04 1973-12-19
JPS5121313U (enrdf_load_stackoverflow) * 1974-08-02 1976-02-17

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (de) * 1963-09-30 1967-08-10 Siemens Ag Gedruckte Schaltung
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100660A (enrdf_load_stackoverflow) * 1972-04-04 1973-12-19
JPS5121313U (enrdf_load_stackoverflow) * 1974-08-02 1976-02-17

Also Published As

Publication number Publication date
IL56306A (en) 1982-07-30
JPS639396B2 (enrdf_load_stackoverflow) 1988-02-29
IL56306A0 (en) 1979-03-12
ATA704878A (de) 1984-09-15
AU531356B2 (en) 1983-08-18
AU4445479A (en) 1979-09-06
IT7947865A0 (it) 1979-02-02
SE7809290L (sv) 1979-08-29
DK385578A (da) 1979-08-29
DK152480B (da) 1988-02-29
DE2809013C2 (de) 1985-08-01
DE2809013A1 (de) 1979-08-30
DK152480C (da) 1988-07-25
AT377889B (de) 1985-05-10
SE443276B (sv) 1986-02-17
CA1131746A (en) 1982-09-14
JPS58103163U (ja) 1983-07-13

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