JPS54117682A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS54117682A
JPS54117682A JP2481278A JP2481278A JPS54117682A JP S54117682 A JPS54117682 A JP S54117682A JP 2481278 A JP2481278 A JP 2481278A JP 2481278 A JP2481278 A JP 2481278A JP S54117682 A JPS54117682 A JP S54117682A
Authority
JP
Japan
Prior art keywords
lead wires
crushed
parts
mass
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2481278A
Other languages
Japanese (ja)
Inventor
Toshimi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2481278A priority Critical patent/JPS54117682A/en
Publication of JPS54117682A publication Critical patent/JPS54117682A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To mass-produce semiconductor devices by making lead wires, where a part is crushed flat, orthogonal to one another with the center of the crushed parts and connecting substances of two-terminal semiconductors between these lead wires.
CONSTITUTION: Silver-plated copper wire 4 of 1.5mmϕ is pressed at a prescribed interval to make flat crushed parts 5. Lead wires 4 are provided in parallel so that crushed parts 5 may be arranged. Semiconductor chip 2 where sloder 3 is caused to adhere to both terminal parts previously is put on crushed part 5, and lead wires 4 are put on the lead wires above orthogonally to them, and a heater is brought into contact with crushed parts from the upper part of the lead wire group, thereby soldering chip 2. Lead wires are cut off vertically and horizontally and are subjected to resin seal and are cut into a prescribed length. Thus, semiconductor devices can be mass-produced easily.
COPYRIGHT: (C)1979,JPO&Japio
JP2481278A 1978-03-03 1978-03-03 Production of semiconductor device Pending JPS54117682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2481278A JPS54117682A (en) 1978-03-03 1978-03-03 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2481278A JPS54117682A (en) 1978-03-03 1978-03-03 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54117682A true JPS54117682A (en) 1979-09-12

Family

ID=12148594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2481278A Pending JPS54117682A (en) 1978-03-03 1978-03-03 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54117682A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618890U (en) * 1992-08-21 1994-03-11 三菱重工業株式会社 Resin mold transformer mounting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618890U (en) * 1992-08-21 1994-03-11 三菱重工業株式会社 Resin mold transformer mounting structure

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