JPS54100931A - Electroless nickel plating - Google Patents
Electroless nickel platingInfo
- Publication number
- JPS54100931A JPS54100931A JP730278A JP730278A JPS54100931A JP S54100931 A JPS54100931 A JP S54100931A JP 730278 A JP730278 A JP 730278A JP 730278 A JP730278 A JP 730278A JP S54100931 A JPS54100931 A JP S54100931A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- activated
- layer
- immersed
- seconds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP730278A JPS54100931A (en) | 1978-01-27 | 1978-01-27 | Electroless nickel plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP730278A JPS54100931A (en) | 1978-01-27 | 1978-01-27 | Electroless nickel plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54100931A true JPS54100931A (en) | 1979-08-09 |
JPS6131188B2 JPS6131188B2 (ja) | 1986-07-18 |
Family
ID=11662218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP730278A Granted JPS54100931A (en) | 1978-01-27 | 1978-01-27 | Electroless nickel plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54100931A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63483A (ja) * | 1986-06-19 | 1988-01-05 | Shinko Electric Ind Co Ltd | 無解電ニツケルめつき用活性化液 |
JPS63252446A (ja) * | 1987-04-09 | 1988-10-19 | Toshiba Corp | はんだバンプの形成方法 |
JPS63305532A (ja) * | 1987-06-05 | 1988-12-13 | Toshiba Corp | バンプの形成方法 |
KR20140023368A (ko) * | 2011-05-17 | 2014-02-26 | 아토테크더치랜드게엠베하 | 무전해 도금 방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5105137B2 (ja) * | 2006-04-25 | 2012-12-19 | 日立化成工業株式会社 | 銅箔を有する基板の製造方法及び銅箔を有する基板 |
JP5109399B2 (ja) * | 2006-09-06 | 2012-12-26 | 日立化成工業株式会社 | 銅の表面処理方法 |
-
1978
- 1978-01-27 JP JP730278A patent/JPS54100931A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63483A (ja) * | 1986-06-19 | 1988-01-05 | Shinko Electric Ind Co Ltd | 無解電ニツケルめつき用活性化液 |
JPS63252446A (ja) * | 1987-04-09 | 1988-10-19 | Toshiba Corp | はんだバンプの形成方法 |
JPS63305532A (ja) * | 1987-06-05 | 1988-12-13 | Toshiba Corp | バンプの形成方法 |
KR20140023368A (ko) * | 2011-05-17 | 2014-02-26 | 아토테크더치랜드게엠베하 | 무전해 도금 방법 |
JP2014513755A (ja) * | 2011-05-17 | 2014-06-05 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 無電解メッキのための方法 |
US9822034B2 (en) | 2011-05-17 | 2017-11-21 | Atotech Deutschland Gmbh | Method for electroless plating |
Also Published As
Publication number | Publication date |
---|---|
JPS6131188B2 (ja) | 1986-07-18 |
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