JPS54100931A - Electroless nickel plating - Google Patents

Electroless nickel plating

Info

Publication number
JPS54100931A
JPS54100931A JP730278A JP730278A JPS54100931A JP S54100931 A JPS54100931 A JP S54100931A JP 730278 A JP730278 A JP 730278A JP 730278 A JP730278 A JP 730278A JP S54100931 A JPS54100931 A JP S54100931A
Authority
JP
Japan
Prior art keywords
substrate
activated
layer
immersed
seconds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP730278A
Other languages
English (en)
Other versions
JPS6131188B2 (ja
Inventor
Kenichi Otsuka
Shunji Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP730278A priority Critical patent/JPS54100931A/ja
Publication of JPS54100931A publication Critical patent/JPS54100931A/ja
Publication of JPS6131188B2 publication Critical patent/JPS6131188B2/ja
Granted legal-status Critical Current

Links

JP730278A 1978-01-27 1978-01-27 Electroless nickel plating Granted JPS54100931A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP730278A JPS54100931A (en) 1978-01-27 1978-01-27 Electroless nickel plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP730278A JPS54100931A (en) 1978-01-27 1978-01-27 Electroless nickel plating

Publications (2)

Publication Number Publication Date
JPS54100931A true JPS54100931A (en) 1979-08-09
JPS6131188B2 JPS6131188B2 (ja) 1986-07-18

Family

ID=11662218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP730278A Granted JPS54100931A (en) 1978-01-27 1978-01-27 Electroless nickel plating

Country Status (1)

Country Link
JP (1) JPS54100931A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63483A (ja) * 1986-06-19 1988-01-05 Shinko Electric Ind Co Ltd 無解電ニツケルめつき用活性化液
JPS63252446A (ja) * 1987-04-09 1988-10-19 Toshiba Corp はんだバンプの形成方法
JPS63305532A (ja) * 1987-06-05 1988-12-13 Toshiba Corp バンプの形成方法
KR20140023368A (ko) * 2011-05-17 2014-02-26 아토테크더치랜드게엠베하 무전해 도금 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5105137B2 (ja) * 2006-04-25 2012-12-19 日立化成工業株式会社 銅箔を有する基板の製造方法及び銅箔を有する基板
JP5109399B2 (ja) * 2006-09-06 2012-12-26 日立化成工業株式会社 銅の表面処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63483A (ja) * 1986-06-19 1988-01-05 Shinko Electric Ind Co Ltd 無解電ニツケルめつき用活性化液
JPS63252446A (ja) * 1987-04-09 1988-10-19 Toshiba Corp はんだバンプの形成方法
JPS63305532A (ja) * 1987-06-05 1988-12-13 Toshiba Corp バンプの形成方法
KR20140023368A (ko) * 2011-05-17 2014-02-26 아토테크더치랜드게엠베하 무전해 도금 방법
JP2014513755A (ja) * 2011-05-17 2014-06-05 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 無電解メッキのための方法
US9822034B2 (en) 2011-05-17 2017-11-21 Atotech Deutschland Gmbh Method for electroless plating

Also Published As

Publication number Publication date
JPS6131188B2 (ja) 1986-07-18

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