JPS5394769A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5394769A JPS5394769A JP901877A JP901877A JPS5394769A JP S5394769 A JPS5394769 A JP S5394769A JP 901877 A JP901877 A JP 901877A JP 901877 A JP901877 A JP 901877A JP S5394769 A JPS5394769 A JP S5394769A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- lead
- frame
- evade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP901877A JPS5394769A (en) | 1977-01-29 | 1977-01-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP901877A JPS5394769A (en) | 1977-01-29 | 1977-01-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5394769A true JPS5394769A (en) | 1978-08-19 |
Family
ID=11708905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP901877A Pending JPS5394769A (en) | 1977-01-29 | 1977-01-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5394769A (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5050883A (ja) * | 1973-09-05 | 1975-05-07 | ||
JPS51126066A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Resin sealing method of the semi-conductor element |
-
1977
- 1977-01-29 JP JP901877A patent/JPS5394769A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5050883A (ja) * | 1973-09-05 | 1975-05-07 | ||
JPS51126066A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Resin sealing method of the semi-conductor element |
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