JPS5384559A - Manufacture for semiconductor package - Google Patents

Manufacture for semiconductor package

Info

Publication number
JPS5384559A
JPS5384559A JP16027176A JP16027176A JPS5384559A JP S5384559 A JPS5384559 A JP S5384559A JP 16027176 A JP16027176 A JP 16027176A JP 16027176 A JP16027176 A JP 16027176A JP S5384559 A JPS5384559 A JP S5384559A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor package
excessive
side wall
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16027176A
Other languages
Japanese (ja)
Other versions
JPS6056308B2 (en
Inventor
Norishige Hisatsugu
Kinshiro Kosemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16027176A priority Critical patent/JPS6056308B2/en
Publication of JPS5384559A publication Critical patent/JPS5384559A/en
Publication of JPS6056308B2 publication Critical patent/JPS6056308B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To manufacture the semiconductor package having uniform static capacitance, by easily removing the excessive metallized metal attached on the dielectric side wall surface with ultrasonic wave machining.
COPYRIGHT: (C)1978,JPO&Japio
JP16027176A 1976-12-29 1976-12-29 Manufacturing method of semiconductor package Expired JPS6056308B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16027176A JPS6056308B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16027176A JPS6056308B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor package

Publications (2)

Publication Number Publication Date
JPS5384559A true JPS5384559A (en) 1978-07-26
JPS6056308B2 JPS6056308B2 (en) 1985-12-09

Family

ID=15711381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16027176A Expired JPS6056308B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor package

Country Status (1)

Country Link
JP (1) JPS6056308B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03127514U (en) * 1990-04-06 1991-12-24

Also Published As

Publication number Publication date
JPS6056308B2 (en) 1985-12-09

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